MT53D1024M64D8NW-053 WT ES:D

IC DRAM 64GBIT 1.866GHZ 432VFBGA
Part Description

IC DRAM 64GBIT 1.866GHZ 432VFBGA

Quantity 404 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-VFBGA (15x15)Memory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.866 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackaging432-VFBGA
Mounting MethodVolatileMemory InterfaceN/AMemory Organization1G x 64
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.0036

Overview of MT53D1024M64D8NW-053 WT ES:D – IC DRAM 64GBIT 1.866GHZ 432VFBGA

The MT53D1024M64D8NW-053 WT ES:D is a volatile SDRAM device implemented in Mobile LPDDR4 technology, organized as 1G × 64 for a total density of 64 Gbit. It provides high-speed mobile DRAM operation with a specified clock frequency of 1.866 GHz and a nominal supply voltage of 1.1 V.

Packaged in a compact 432-VFBGA (15×15) and rated for operation from −30°C to 85°C (TC), this DRAM device targets mobile and embedded memory subsystems that require high data rate, high-density LPDDR4 memory integration.

Key Features

  • Memory Core Mobile LPDDR4 SDRAM architecture, organized as 1G × 64 for a total of 64 Gbit density.
  • Performance Rated clock frequency of 1.866 GHz to support high-speed memory transfers in LPDDR4 designs.
  • Power Nominal supply voltage of 1.1 V consistent with LPDDR4 low-voltage operation.
  • Package 432-VFBGA package in a 15×15 mm footprint for compact, board-level integration.
  • Environmental Range Operating temperature range from −30°C to 85°C (TC) for a variety of thermal environments.
  • Memory Format Volatile DRAM suitable for high-speed working memory applications in LPDDR4 systems.

Typical Applications

  • Mobile devices — High-density LPDDR4 memory for handheld devices and mobile platforms requiring 64 Gbit DRAM capacity.
  • Embedded systems — On-board working memory for embedded designs that need low-voltage, high-bandwidth DRAM.
  • Compact module designs — Integration into space-constrained printed circuit boards using the 432-VFBGA (15×15) package.

Unique Advantages

  • High-density memory: 64 Gbit capacity (1G × 64) provides significant DRAM capacity in a single device.
  • High-speed operation: 1.866 GHz clock frequency supports fast data throughput for LPDDR4 memory channels.
  • Low-voltage operation: 1.1 V supply reduces power draw compared with higher-voltage memories where applicable.
  • Compact packaging: 432-VFBGA (15×15) package enables dense board integration and space savings.
  • Extended temperature range: Rated −30°C to 85°C (TC) to accommodate a range of thermal operating conditions.

Why Choose MT53D1024M64D8NW-053 WT ES:D?

This Micron Technology Inc. Mobile LPDDR4 DRAM device combines 64 Gbit density, 1.866 GHz clocking, and 1.1 V operation in a compact 432-VFBGA (15×15) package, offering a clear option for designs that require high-speed, low-voltage DRAM integration. The device's specified operating temperature range supports deployment across a variety of thermal environments.

The MT53D1024M64D8NW-053 WT ES:D is suited to designers and procurement teams building mobile and embedded platforms that need verified LPDDR4 density and performance from a known memory supplier.

Request a quote or submit an inquiry to receive pricing and availability information for the MT53D1024M64D8NW-053 WT ES:D.

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