MT53D1024M64D8NW-053 WT:D

IC DRAM 64GBIT 1.866GHZ 432VFBGA
Part Description

IC DRAM 64GBIT 1.866GHZ 432VFBGA

Quantity 1,329 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-VFBGA (15x15)Memory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.866 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackaging432-VFBGA
Mounting MethodVolatileMemory InterfaceN/AMemory Organization1G x 64
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MT53D1024M64D8NW-053 WT:D – 64Gbit Mobile LPDDR4 DRAM, 1.866 GHz, 432‑VFBGA

The MT53D1024M64D8NW-053 WT:D is a volatile DRAM device built on Mobile LPDDR4 SDRAM technology. It provides 64 Gbit of memory organized as 1G × 64 and operates at a clock frequency of 1.866 GHz.

Designed for implementations that require a 1.1 V supply and a compact BGA footprint, this device is supplied in a 432‑VFBGA (15×15) package and supports an operating temperature range of −30 °C to 85 °C (TC).

Key Features

  • Memory Core / Architecture  Mobile LPDDR4 SDRAM technology; volatile DRAM organized as 1G × 64 delivering a total capacity of 64 Gbit.
  • Performance  Clock frequency of 1.866 GHz for timing and throughput characteristics defined by the device.
  • Power  Nominal supply voltage of 1.1 V, consistent with mobile LPDDR4 voltage requirements.
  • Package  432‑VFBGA package case with a 15 × 15 mm footprint (432‑VFBGA), suitable for compact board layouts.
  • Operating Temperature  Specified operating temperature range: −30 °C to 85 °C (TC).
  • Memory Format  DRAM memory format with supplier device package specified as 432‑VFBGA.

Unique Advantages

  • High aggregate capacity: 64 Gbit density supports applications requiring substantial DRAM resources within a single device.
  • Defined high-frequency operation: 1.866 GHz clocking provides the device timing characteristics required by systems targeting this frequency.
  • Low-voltage operation: 1.1 V nominal supply reduces system power domain complexity where LPDDR4 supply rails are used.
  • Compact BGA footprint: 432‑VFBGA (15×15) package enables dense PCB integration while maintaining the specified device pinout.
  • Wide temperature range: −30 °C to 85 °C (TC) operating window for deployments within this thermal envelope.

Why Choose IC DRAM 64GBIT 1.866GHZ 432VFBGA?

The MT53D1024M64D8NW-053 WT:D is positioned to deliver a defined combination of capacity, timing, and package density: 64 Gbit of Mobile LPDDR4 DRAM operating at 1.866 GHz with a 1.1 V supply in a 432‑VFBGA (15×15) package. This makes it appropriate for designs that require a specific LPDDR4 memory configuration and footprint.

Its specified operating temperature range and clear electrical parameters simplify component selection for engineers and procurement teams seeking a deterministic memory part with the documented characteristics provided here.

Request a quote or submit a pricing and availability inquiry for MT53D1024M64D8NW-053 WT:D to receive detailed commercial information and lead-time options.

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