MT53D512M64D2BW-046 XT:B
| Part Description |
IC DRAM 32GBIT FBGA |
|---|---|
| Quantity | 281 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 2 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | 512M x 64 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MT53D512M64D2BW-046 XT:B – IC DRAM 32GBIT FBGA
The MT53D512M64D2BW-046 XT:B is a 32 Gbit DRAM device from Micron Technology Inc., implemented in a FBGA package. It utilizes SDRAM - Mobile LPDDR4 technology and is organized as 512M × 64.
This device is targeted at mobile LPDDR4 memory applications where a 32 Gbit density and a 512M × 64 organization are required for system memory or buffering functions.
Key Features
- Memory Technology
SDRAM - Mobile LPDDR4 technology as specified for this part. - Memory Size
32 Gbit total memory capacity provided by the device. - Memory Organization
Configured as 512M × 64 to define data width and depth. - Memory Format
DRAM format suitable for system-level memory applications. - Manufacturer
Produced by Micron Technology Inc., identified by the part number MT53D512M64D2BW-046 XT:B.
Typical Applications
- Mobile Devices
Use in mobile LPDDR4 memory subsystems where a 32 Gbit DRAM component is required. - Consumer Electronics
Integration into consumer products that specify LPDDR4 DRAM with a 512M × 64 organization. - Embedded Systems
Deployment in embedded designs that require a DRAM memory module with the given density and organization.
Unique Advantages
- High Density (32 Gbit): Provides substantial memory capacity for designs that require large DRAM addressing space.
- Mobile LPDDR4 Technology: Specified as SDRAM - Mobile LPDDR4, aligning the part with mobile memory application requirements.
- Clear Memory Organization: 512M × 64 configuration simplifies system architecture planning and memory mapping.
- Standard DRAM Format: DRAM format that fits established memory subsystem designs.
- Established Manufacturer: Micron Technology Inc. part identification ensures traceability to a known supplier.
Why Choose IC DRAM 32GBIT FBGA?
This Micron MT53D512M64D2BW-046 XT:B device is positioned for designs that require a 32 Gbit DRAM solution built on SDRAM - Mobile LPDDR4 technology with a 512M × 64 organization. It is suitable for engineers specifying a known-part DRAM component from an established manufacturer for mobile and embedded memory applications.
The device provides a clear, verifiable specification set—memory size, organization, and technology—making it straightforward to evaluate for system memory and buffering roles where those attributes align with design requirements.
Request a quote or submit an inquiry to receive pricing and availability information for MT53D512M64D2BW-046 XT:B.
