MT53D512M64D2TR-046 XT:B
| Part Description |
IC DRAM 32GBIT FBGA |
|---|---|
| Quantity | 765 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 2 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | 512M x 64 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MT53D512M64D2TR-046 XT:B – IC DRAM 32GBIT FBGA
The MT53D512M64D2TR-046 XT:B is a 32 Gbit DRAM device from Micron Technology Inc. It implements Mobile LPDDR4 SDRAM architecture and is organized as 512M × 64. The device is targeted at designs requiring high-density DRAM in an FBGA package form factor.
Key Features
- Memory Type SDRAM in Mobile LPDDR4 technology as specified in the product data.
- Density 32 Gbit total memory capacity, suitable for applications needing large DRAM capacity on a single device.
- Organization Configured as 512M × 64, providing the stated data width and memory depth.
- Memory Format DRAM—offering standard dynamic RAM behavior as identified in the product listing.
- Package FBGA package type indicated by the product name.
- Manufacturer Produced by Micron Technology Inc., as listed in the product data.
Typical Applications
- Mobile devices Mobile LPDDR4 architecture makes the device applicable for memory subsystems in mobile and handheld designs.
- High-density memory modules 32 Gbit capacity supports implementations where a single DRAM device provides substantial memory footprint.
- Embedded systems Can be used in embedded platforms that integrate LPDDR4 DRAM for system memory.
Unique Advantages
- High capacity in a single device: 32 Gbit density reduces the number of devices required to reach target memory sizes.
- LPDDR4 architecture alignment: Listed as Mobile LPDDR4 SDRAM, aligning the device with LPDDR4 memory system designs.
- Clear memory organization: 512M × 64 configuration simplifies memory mapping and system planning.
- FBGA package format: Packaged in FBGA as indicated by the product name, supporting standard BGA assembly processes.
- Manufacturer transparency: Micron Technology Inc. identified as the supplier in the product data.
Why Choose IC DRAM 32GBIT FBGA?
The MT53D512M64D2TR-046 XT:B provides a straightforward, high-density LPDDR4 DRAM option for designs that require 32 Gbit capacity and a 512M × 64 organization in an FBGA package. Its specification entries emphasize capacity and architecture, making it a clear choice for engineers planning memory subsystems around Mobile LPDDR4 technology.
This device is suited for teams and projects where documented memory size, organization, and LPDDR4 technology alignment are primary selection criteria. The Micron Technology Inc. designation in the product data offers a clear source identification for procurement and bill-of-materials consistency.
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