MT53E1G32D2NP-053 RS WT:A
| Part Description |
IC DRAM 32GBIT FBGA |
|---|---|
| Quantity | 72 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MT53E1G32D2NP-053 RS WT:A – IC DRAM 32GBIT FBGA
The MT53E1G32D2NP-053 RS WT:A is a 32 Gbit DRAM device based on Mobile LPDDR4 SDRAM architecture. It is organized as 1G × 32 and packaged in an FBGA form factor.
This device is intended for designs that require high-density mobile LPDDR4 memory in a compact package, enabling integration into systems that reference Mobile LPDDR4 technology and 32 Gbit capacity.
Key Features
- Memory Technology Mobile LPDDR4 SDRAM architecture as specified in the product data.
- Capacity 32 Gbit total memory size for high-density memory requirements.
- Organization 1G × 32 memory organization, providing a 32-bit data arrangement.
- Package FBGA package format as indicated in the product description.
- Device Type DRAM memory device intended for use where Mobile LPDDR4 is specified.
Typical Applications
- Mobile devices: Integration into systems that specify Mobile LPDDR4 SDRAM for high-density memory requirements.
- Embedded systems: Use in compact platforms where a 32 Gbit DRAM device in FBGA is required.
- Memory modules and subsystems: Component option for designs specifying 1G × 32 mobile LPDDR4 arrangements.
Unique Advantages
- High-density capacity: 32 Gbit memory size supports designs needing larger DRAM capacity.
- Mobile LPDDR4 architecture: Conforms to Mobile LPDDR4 SDRAM technology as listed in the product data.
- Clear organization: 1G × 32 arrangement simplifies mapping to 32-bit data configurations.
- Compact FBGA packaging: FBGA package supports integration into space-constrained board layouts.
- Manufacturer identification: Supplied by Micron Technology Inc., as stated in the product information.
Why Choose MT53E1G32D2NP-053 RS WT:A?
The MT53E1G32D2NP-053 RS WT:A positions itself as a high-density Mobile LPDDR4 DRAM option with a 32 Gbit capacity and a 1G × 32 organization in an FBGA package. Its specification set is suited to designs calling for mobile LPDDR4 memory in a compact form factor.
This device is appropriate for engineers and procurement teams specifying DRAM components from Micron Technology Inc. where the listed capacity, organization, and package are required. Its characteristics support longer-term designs that reference Mobile LPDDR4 memory architectures and high-density DRAM components.
Request a quote or submit an inquiry to obtain pricing and availability information for the MT53E1G32D2NP-053 RS WT:A.
