MT53E1G32D2NP-053 RS WT:B
| Part Description |
IC DRAM 32GBIT FBGA |
|---|---|
| Quantity | 134 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MT53E1G32D2NP-053 RS WT:B – IC DRAM 32GBIT FBGA
The MT53E1G32D2NP-053 RS WT:B is a 32 Gbit DRAM device from Micron Technology Inc., specified as SDRAM - Mobile LPDDR4. The device is organized as 1G × 32 and is offered in an FBGA form factor.
It is targeted at designs requiring high-density mobile DRAM memory in a compact package, providing a straightforward component choice for systems that reference Mobile LPDDR4 technology and a 1G × 32 memory organization.
Key Features
- Memory Technology Designated as SDRAM - Mobile LPDDR4, indicating the device implements LPDDR4 mobile DRAM technology.
- Memory Size 32 Gbit total memory capacity for high-density applications.
- Memory Organization Organized as 1G × 32, providing a 32-bit data organization.
- Memory Format Classified as DRAM, suitable where dynamic RAM is required.
- Package Listed in the part name as FBGA, denoting a ball grid array package format.
- Manufacturer Supplied by Micron Technology Inc., identified by the Micron part number MT53E1G32D2NP-053 RS WT:B.
Typical Applications
- Mobile devices — Fits designs that reference Mobile LPDDR4 memory technology and need 32 Gbit density in a compact package.
- Compact embedded systems — Suited to space-constrained systems requiring high-density DRAM organized as 1G × 32.
- Consumer electronics — Applicable where a DRAM component with Mobile LPDDR4 designation and 32 Gbit capacity is specified.
Unique Advantages
- High memory density: 32 Gbit capacity supports designs that require substantial DRAM resources.
- Mobile LPDDR4 designation: Matches mobile DRAM technology naming for designs targeting LPDDR4-based memory architectures.
- 32-bit organization: The 1G × 32 organization provides a clear 32-bit data arrangement for system integration.
- FBGA packaging: Identified in the part name as FBGA, offering a ball grid array package option for compact board layouts.
- Micron part identification: Delivered under Micron Technology Inc. part number MT53E1G32D2NP-053 RS WT:B for procurement and inventory tracking.
Why Choose MT53E1G32D2NP-053 RS WT:B?
This Micron 32 Gbit DRAM device provides a clear specification set—SDRAM Mobile LPDDR4 technology, 1G × 32 organization, and FBGA package—making it suitable for engineers specifying high-density mobile DRAM components. Its defined capacity and organization simplify selection for designs that require a 32-bit DRAM memory element in a compact package.
Choose this part when your design requirements call for a 32 Gbit DRAM with Mobile LPDDR4 technology and explicit part-level identification from Micron Technology Inc.
To request a quote or discuss availability and pricing for MT53E1G32D2NP-053 RS WT:B, please contact sales or submit a request for quotation through your usual procurement channels.
