MT53E1G32D2NP-053 RS WT:A TR
| Part Description |
IC DRAM 32GBIT FBGA |
|---|---|
| Quantity | 294 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MT53E1G32D2NP-053 RS WT:A TR – IC DRAM 32GBIT FBGA
The MT53E1G32D2NP-053 RS WT:A TR is a 32 Gbit DRAM device from Micron Technology Inc. It implements SDRAM - Mobile LPDDR4 architecture and is identified in its product designation as an FBGA-packaged IC DRAM.
This device provides high-density volatile memory in a 1G × 32 organization suitable for mobile LPDDR4 memory subsystems and designs that require 32 Gbit DRAM capacity.
Key Features
- Memory Capacity 32 Gbit total memory size as specified in the product data.
- Technology Based on SDRAM - Mobile LPDDR4 technology.
- Memory Organization Configured as 1G × 32 to define data width and organization.
- Memory Format DRAM device intended for volatile system memory applications.
- Package Identification Designated as FBGA in the product name.
- Manufacturer Produced by Micron Technology Inc.
Typical Applications
- Mobile Devices — Serves as DRAM in mobile LPDDR4 memory subsystems where high-density volatile memory is required.
- Memory Subsystems — Acts as a building block for high-capacity DRAM arrays in compact system designs.
- Mobile LPDDR4 Designs — Intended for designs that specify Mobile LPDDR4 SDRAM technology and a 1G × 32 memory organization.
Unique Advantages
- High Density Capacity: 32 Gbit device provides substantial memory capacity for demanding LPDDR4 subsystems.
- Mobile LPDDR4 Architecture: Built on SDRAM - Mobile LPDDR4 technology as indicated in the product specifications.
- Defined Data Organization: 1G × 32 organization clarifies data width and integration approach for system designers.
- FBGA Designation: Product name includes FBGA packaging, aligning with board-level assembly and layout considerations.
- Micron Manufacturing: Supplied by Micron Technology Inc., a named manufacturer in the product data.
Why Choose IC DRAM 32GBIT FBGA?
The MT53E1G32D2NP-053 RS WT:A TR positions itself as a 32 Gbit DRAM solution built on Mobile LPDDR4 SDRAM architecture, providing a clear capacity and organization specification (1G × 32) for mobile-oriented memory subsystem designs. Its designation as an FBGA device and listing under Micron Technology Inc. make its basic form factor and manufacturer identity explicit for procurement and design integration.
This part is suitable for engineers and buyers seeking a defined 32 Gbit DRAM component based on Mobile LPDDR4 technology and a 1G × 32 organization, where specification-driven selection and straightforward integration notes (capacity, technology, organization, packaging designation) are the primary decision factors.
Request a quote or submit a sales inquiry for MT53E1G32D2NP-053 RS WT:A TR to obtain pricing and availability information.
