MT53E1G32D4NQ-053 RS WT:J TR
| Part Description |
IC DRAM 32GBIT FBGA |
|---|---|
| Quantity | 262 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MT53E1G32D4NQ-053 RS WT:J TR – IC DRAM 32GBIT FBGA
The MT53E1G32D4NQ-053 RS WT:J TR is a 32 Gbit DRAM device manufactured by Micron Technology Inc. It implements Mobile LPDDR4 SDRAM architecture in an FBGA form factor, intended for applications that require high-density volatile memory in compact board layouts.
This device is positioned for use in systems adopting mobile LPDDR4 memory technology where a 1G x 32 organization and 32 Gbit capacity are required.
Key Features
- Memory Technology Mobile LPDDR4 SDRAM technology as specified for mobile memory architectures.
- Memory Size 32 Gbit capacity providing a high-density DRAM solution.
- Memory Organization 1G × 32 organization for clear data-width planning and system integration.
- Memory Format DRAM memory format for volatile, random-access storage.
- Package FBGA package indicated in the product descriptor for compact board-level integration.
- Manufacturer Micron Technology Inc. listed as the device manufacturer for sourcing considerations.
Typical Applications
- Mobile Devices Use in mobile device memory subsystems that require Mobile LPDDR4 SDRAM with 32 Gbit density.
- Portable Electronics Integration in space-constrained portable products where FBGA packaging is advantageous.
- Memory-Dense Modules Suitable for modules and systems that require a 1G × 32 DRAM organization and significant memory capacity.
Unique Advantages
- High-density Capacity: 32 Gbit memory size supports designs with substantial volatile memory requirements.
- Mobile LPDDR4 Technology: Aligns with mobile memory design approaches where LPDDR4 is specified.
- Deterministic Organization: 1G × 32 organization aids in predictable data bus and addressing planning.
- Compact Packaging: FBGA form factor supports compact PCB layouts and integration in space-limited designs.
- Established Manufacturer: Supplied by Micron Technology Inc., providing a known source for procurement.
Why Choose IC DRAM 32GBIT FBGA?
The MT53E1G32D4NQ-053 RS WT:J TR combines Mobile LPDDR4 SDRAM technology with a 32 Gbit density and a 1G × 32 organization to address designs that require substantial volatile memory in compact form factors. Its FBGA descriptor indicates suitability for board-level integration where space and density matter.
This part is suitable for engineers and procurement teams specifying mobile LPDDR4 DRAM components from Micron Technology Inc. for devices and modules that need high-density, organized DRAM memory solutions without additional specification requirements provided here.
Request a quote or submit an inquiry for MT53E1G32D4NQ-053 RS WT:J TR to discuss availability, lead times, and pricing details.
