MT53E1G32D4NQ-053 RS WT:J
| Part Description |
IC DRAM 32GBIT FBGA |
|---|---|
| Quantity | 1,116 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MT53E1G32D4NQ-053 RS WT:J – IC DRAM 32GBIT FBGA
The MT53E1G32D4NQ-053 RS WT:J is a 32 Gbit DRAM device from Micron Technology Inc. It is implemented as mobile LPDDR4 SDRAM with a 1G × 32 memory organization and supplied in an FBGA package.
This device targets designs requiring high-density DRAM in a mobile LPDDR4 architecture, where a 1G × 32 organization and 32 Gbit capacity are primary selection criteria.
Key Features
- Memory Type Implemented as SDRAM - Mobile LPDDR4 according to the provided product data.
- Memory Size 32 Gbit total capacity for high-density memory requirements.
- Memory Organization Organized as 1G × 32, suitable for designs expecting a 32-bit wide DRAM configuration.
- Package Listed in the product name as an FBGA package format.
- Manufacturer Supplied by Micron Technology Inc., as specified in the product record.
- Product Identifier Part number MT53E1G32D4NQ-053 RS WT:J uniquely identifies this DRAM device.
Typical Applications
- Mobile Devices Use where mobile LPDDR4 DRAM is required for memory subsystems in mobile form factors.
- Portable Electronics Integration into compact platforms that require a 32 Gbit DRAM footprint in FBGA packaging.
- Embedded Systems High-density DRAM option for embedded designs that specify a 1G × 32 memory organization.
Unique Advantages
- High memory density: 32 Gbit capacity enables larger memory footprints without multiple devices.
- Standardized organization: 1G × 32 arrangement aligns with 32-bit memory configurations for straightforward sizing decisions.
- Mobile LPDDR4 architecture: Identified as mobile LPDDR4 SDRAM in the product data, indicating its classification within LPDDR4 offerings.
- FBGA packaging: FBGA package format is specified in the product name, suitable for compact PCB layouts.
- Clear product traceability: Part number MT53E1G32D4NQ-053 RS WT:J and manufacturer Micron Technology Inc. are provided for procurement and qualification workflows.
Why Choose IC DRAM 32GBIT FBGA?
This MT53E1G32D4NQ-053 RS WT:J device is positioned as a high-density, mobile LPDDR4 DRAM option in an FBGA package, delivering a 32 Gbit capacity with a 1G × 32 organization. It is suitable for designs that require a clearly identified, high-capacity DRAM component from Micron Technology Inc.
Designers and procurement teams seeking a defined LPDDR4 memory part with a specific organization and capacity can rely on the provided part identification and specifications for BOM decisions and system planning.
Request a quote or submit an RFQ to obtain pricing and availability details for MT53E1G32D4NQ-053 RS WT:J.
