MT53E1G64D4HJ-046 AIT:A
| Part Description |
IC DRAM 64GBIT PAR 556WFBGA |
|---|---|
| Quantity | 878 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 556-WFBGA (12.4x12.4) | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4X | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | 2.133 GHz | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | 556-TFBGA | ||
| Mounting Method | N/A | Memory Interface | Parallel | Memory Organization | 1G x 64 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MT53E1G64D4HJ-046 AIT:A – IC DRAM 64GBIT PAR 556WFBGA
The MT53E1G64D4HJ-046 AIT:A is a 64 Gbit DRAM device implemented in Mobile LPDDR4X SDRAM architecture. It is organized as 1G x 64 with a parallel memory interface and a specified clock frequency of 2.133 GHz.
This device is supplied in a 556-ball TFBGA/WFBGA package (556-WFBGA, 12.4 × 12.4 mm) for compact board-level integration and is targeted at mobile memory implementations and systems requiring high-density parallel DRAM.
Key Features
- Memory Technology SDRAM implemented as Mobile LPDDR4X, providing the architecture type of the device.
- Memory Size & Organization 64 Gbit total capacity organized as 1G × 64 to present a wide data path.
- Interface & Clock Parallel memory interface with a clock frequency of 2.133 GHz.
- Package 556-TFBGA package case; supplier device package listed as 556-WFBGA with package dimensions 12.4 × 12.4 mm.
- Memory Format DRAM format suited to standard DRAM integration approaches.
- Manufacturer Produced by Micron Technology Inc.
Typical Applications
- Mobile Devices Use as LPDDR4X DRAM in mobile device memory subsystems that require 64 Gbit capacity and a 1G × 64 organization.
- Embedded Memory Modules Integration into embedded memory boards where a parallel DRAM interface and 2.133 GHz clock support system memory requirements.
- Compact Board Designs Suitable for compact, high-density board layouts thanks to the 556-WFBGA (12.4 × 12.4 mm) package footprint.
Unique Advantages
- High-density memory: 64 Gbit capacity provides substantial on-board DRAM density in a single device.
- Wide data organization: 1G × 64 organization offers a 64-bit data path for parallel memory architectures.
- Defined clock capability: Rated for a 2.133 GHz clock frequency to meet specified timing requirements.
- Mobile LPDDR4X architecture: Designed using Mobile LPDDR4X SDRAM technology, aligning with mobile-oriented DRAM designs.
- Compact BGA packaging: Available in a 556-TFBGA / 556-WFBGA package with 12.4 × 12.4 mm dimensions for space-constrained layouts.
- Established supplier: Manufactured by Micron Technology Inc., providing traceability to a recognized memory supplier.
Why Choose IC DRAM 64GBIT PAR 556WFBGA?
The MT53E1G64D4HJ-046 AIT:A positions itself as a high-density LPDDR4X DRAM option with a 1G × 64 organization and a 2.133 GHz clock specification, delivered in a compact 556-ball BGA package. It is suited to designs that require sizable parallel DRAM capacity in a small footprint.
This device is appropriate for engineers and procurement teams specifying mobile LPDDR4X memory solutions, offering straightforward capacity and interface characteristics to match parallel DRAM system requirements while carrying the Micron Technology Inc. device designation.
Request a quote or contact sales to discuss pricing and availability for MT53E1G64D4HJ-046 AIT:A.
