MT53E1G64D4HJ-046 AUT:C TR

IC DRAM 64GBIT PAR 556WFBGA
Part Description

IC DRAM 64GBIT PAR 556WFBGA

Quantity 344 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Device Package556-WFBGA (12.4x12.4)Memory FormatDRAMTechnologySDRAM - Mobile LPDDR4X
Memory Size64 GbitAccess Time3.5 nsGradeAutomotive
Clock Frequency2.133 GHzVoltage1.06V ~ 1.17VMemory TypeVolatile
Operating Temperature-40°C ~ 125°C (TC)Write Cycle Time Word Page18 nsPackaging556-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization1G x 64
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of MT53E1G64D4HJ-046 AUT:C TR – Mobile LPDDR4X 64Gbit DRAM (556 WFBGA)

The MT53E1G64D4HJ-046 AUT:C TR is a 64 Gbit volatile DRAM organized as 1G x 64 using mobile LPDDR4X SDRAM architecture. It delivers high-speed memory access in a compact 556 WFBGA package for designs that require dense, low-voltage system memory.

Designed and qualified for automotive use, this device targets applications that need high throughput, compact integration, and operation across extended temperature ranges.

Key Features

  • Memory Core 64 Gbit capacity organized as 1G × 64 using mobile LPDDR4X SDRAM technology.
  • Performance Supports a clock frequency of 2.133 GHz with an access time of 3.5 ns and a write cycle time (word page) of 18 ns for low-latency operation.
  • Power Low-voltage operation with a supply range of 1.06 V to 1.17 V to support reduced power consumption in mobile and embedded systems.
  • Interface Parallel memory interface suitable for high-bandwidth system integration.
  • Package 556-TFBGA / 556-WFBGA supplier device package with a 12.4 × 12.4 mm footprint for dense board-level integration.
  • Temperature & Qualification Automotive-grade device with AEC-Q100 qualification and an operating temperature range of −40°C to 125°C (TC) for high-reliability environments.

Typical Applications

  • Automotive systems — Memory for vehicle electronic control units and infotainment where AEC-Q100 qualification and extended temperature range are required.
  • Mobile devices — High-density mobile LPDDR4X memory for compact, low-voltage platform designs.
  • Embedded systems — Volatile high-speed memory for embedded controllers and compute modules that require parallel memory interfaces.

Unique Advantages

  • High-density memory: 64 Gbit capacity (1G × 64) enables large memory footprints in a single device, simplifying board-level BOM.
  • High-speed operation: 2.133 GHz clock and 3.5 ns access time support demanding bandwidth and latency requirements.
  • Automotive-grade qualification: AEC-Q100 qualification and −40°C to 125°C operating range provide suitability for automotive and other demanding environments.
  • Low-voltage operation: 1.06 V–1.17 V supply reduces system power draw compared with higher-voltage memories.
  • Compact package: 556 WFBGA (12.4 × 12.4 mm) enables dense integration in space-constrained designs.
  • Parallel interface: Parallel memory interface simplifies integration with compatible system controllers and data paths.

Why Choose MT53E1G64D4HJ-046 AUT:C TR?

The MT53E1G64D4HJ-046 AUT:C TR combines high-density LPDDR4X architecture with automotive-grade qualification and a compact 556 WFBGA package to deliver a balance of performance, low-voltage efficiency, and environmental robustness. It is suited to designers seeking a verified, high-throughput volatile memory solution for automotive, mobile, and embedded platforms.

This device supports designs that require scalability of memory capacity, reliable operation across extended temperature ranges, and integration into compact board layouts while maintaining low supply voltage requirements.

Request a quote or contact sales to discuss pricing, availability, and lead times for the MT53E1G64D4HJ-046 AUT:C TR.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up