MT53E1G64D4NW-046 WT:C
| Part Description |
IC DRAM 64GBIT 432VFBGA |
|---|---|
| Quantity | 1,229 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 39 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 432-VFBGA (15x15) | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4X | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | 432-VFBGA | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MT53E1G64D4NW-046 WT:C – IC DRAM 64GBIT 432VFBGA
The MT53E1G64D4NW-046 WT:C is a 64 Gbit DRAM device from Micron Technology Inc., implemented as SDRAM in mobile LPDDR4X technology. It is presented in a compact 432-VFBGA (15×15) package for board-level integration.
This part targets designs that require high-density LPDDR4X DRAM in a small-footprint package, providing a straightforward memory option for systems built around mobile LPDDR4X architectures.
Key Features
- Memory Technology Built on SDRAM - Mobile LPDDR4X technology as specified in the product data.
- Memory Size 64 Gbit density for high-capacity memory requirements.
- Memory Format DRAM format suitable for LPDDR4X memory subsystems.
- Package 432-VFBGA (15×15) supplier device package providing a compact BGA footprint.
- Manufacturer Produced by Micron Technology Inc., identified by part number MT53E1G64D4NW-046 WT:C.
Typical Applications
- Mobile memory subsystems Integration where mobile LPDDR4X DRAM is required for system memory.
- High-density embedded devices Designs that need 64 Gbit DRAM in a compact package to minimize PCB area.
- Compact board-level integration Applications that benefit from the 432-VFBGA (15×15) package form factor.
Unique Advantages
- High-density capacity: 64 Gbit memory enables larger in-system memory footprints without multiple devices.
- Mobile LPDDR4X technology: Designed to align with LPDDR4X memory architectures where specified by system requirements.
- Compact VFBGA package: 432-VFBGA (15×15) reduces board area compared to larger package options.
- Clear manufacturer identification: Part produced by Micron Technology Inc., facilitating procurement and BOM specification.
Why Choose MT53E1G64D4NW-046 WT:C?
The MT53E1G64D4NW-046 WT:C offers a straightforward way to specify 64 Gbit LPDDR4X DRAM in designs that require mobile SDRAM technology combined with a compact 432-VFBGA footprint. Its configuration is suitable for engineers specifying high-density memory where LPDDR4X compatibility is a design requirement.
This part is appropriate for projects prioritizing memory density and compact package integration, providing a verifiable Micron part number for supply chain and BOM clarity.
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