MT53E2G32D4DT-046 WT:A TR
| Part Description |
IC DRAM 64GBIT 2.133GHZ FBGA |
|---|---|
| Quantity | 210 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 2.133 GHz | Voltage | 1.1V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TC) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Volatile | Memory Interface | N/A | Memory Organization | 2G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 |
Overview of MT53E2G32D4DT-046 WT:A TR – IC DRAM 64GBIT 2.133GHZ FBGA
The MT53E2G32D4DT-046 WT:A TR is a 64 Gbit volatile DRAM device implemented in Mobile LPDDR4 SDRAM technology. It provides a 2G × 32 memory organization with a 2.133 GHz clock frequency and operates at a 1.1 V supply.
This device is suited for systems and designs that require large-capacity, low-voltage mobile LPDDR4 memory and a defined operating temperature range of -30°C to 85°C.
Key Features
- Memory Core 64 Gbit capacity organized as 2G × 32, implemented as volatile DRAM for transient data storage.
- Technology SDRAM – Mobile LPDDR4 architecture provides the specified mobile DRAM implementation.
- Performance 2.133 GHz clock frequency for high-rate data transfers consistent with the listed clock specification.
- Power 1.1 V supply voltage as specified for low-voltage operation.
- Package FBGA package format as indicated in the product designation.
- Temperature Range Operating temperature specified from -30°C to 85°C (TC).
Typical Applications
- Mobile and handheld devices — Mobile LPDDR4 technology and the 1.1 V supply make this device appropriate for compact, low-voltage memory subsystems.
- High-bandwidth buffers — 2.133 GHz clock frequency supports use where elevated data transfer rates are required within the constraints of the listed specification.
- Embedded systems — Large 64 Gbit capacity and 2G × 32 organization suit embedded designs needing substantial volatile memory.
Unique Advantages
- Large on-die capacity: 64 Gbit memory size enables substantial addressable volatile storage within a single device.
- Defined memory organization: 2G × 32 configuration simplifies system memory mapping and design planning.
- Specified high clock rate: 2.133 GHz clock frequency provides a clear performance parameter for system timing and throughput considerations.
- Low-voltage operation: 1.1 V supply supports designs targeting lower power consumption profiles.
- Wide operating temperature: Rated from -30°C to 85°C for deployment in temperature-variable environments.
- FBGA package format: Compact package designation in the product name supports board-level space considerations.
Why Choose MT53E2G32D4DT-046 WT:A TR?
The MT53E2G32D4DT-046 WT:A TR combines Mobile LPDDR4 SDRAM technology, a 64 Gbit density, and a specified 2.133 GHz clock frequency to deliver a clearly defined memory element for designs requiring substantial volatile storage at low voltage. Its 2G × 32 organization and FBGA package provide concrete integration characteristics for systems engineering and procurement.
This device is appropriate for engineers and procurement teams specifying low-voltage mobile LPDDR4 memory with explicit operating-temperature and clock-frequency requirements, offering predictable electrical and thermal parameters for system-level integration.
Request a quote or submit a pricing inquiry to receive availability and lead-time details for the MT53E2G32D4DT-046 WT:A TR. Sales and quotation teams can provide volume pricing and delivery options based on your project requirements.