MT53E2G32D4DT-046 WT:A TR

IC DRAM 64GBIT 2.133GHZ FBGA
Part Description

IC DRAM 64GBIT 2.133GHZ FBGA

Quantity 210 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency2.133 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodVolatileMemory InterfaceN/AMemory Organization2G x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNPENDING ECCNHTS Code0000.00.0000

Overview of MT53E2G32D4DT-046 WT:A TR – IC DRAM 64GBIT 2.133GHZ FBGA

The MT53E2G32D4DT-046 WT:A TR is a 64 Gbit volatile DRAM device implemented in Mobile LPDDR4 SDRAM technology. It provides a 2G × 32 memory organization with a 2.133 GHz clock frequency and operates at a 1.1 V supply.

This device is suited for systems and designs that require large-capacity, low-voltage mobile LPDDR4 memory and a defined operating temperature range of -30°C to 85°C.

Key Features

  • Memory Core 64 Gbit capacity organized as 2G × 32, implemented as volatile DRAM for transient data storage.
  • Technology SDRAM – Mobile LPDDR4 architecture provides the specified mobile DRAM implementation.
  • Performance 2.133 GHz clock frequency for high-rate data transfers consistent with the listed clock specification.
  • Power 1.1 V supply voltage as specified for low-voltage operation.
  • Package FBGA package format as indicated in the product designation.
  • Temperature Range Operating temperature specified from -30°C to 85°C (TC).

Typical Applications

  • Mobile and handheld devices — Mobile LPDDR4 technology and the 1.1 V supply make this device appropriate for compact, low-voltage memory subsystems.
  • High-bandwidth buffers — 2.133 GHz clock frequency supports use where elevated data transfer rates are required within the constraints of the listed specification.
  • Embedded systems — Large 64 Gbit capacity and 2G × 32 organization suit embedded designs needing substantial volatile memory.

Unique Advantages

  • Large on-die capacity: 64 Gbit memory size enables substantial addressable volatile storage within a single device.
  • Defined memory organization: 2G × 32 configuration simplifies system memory mapping and design planning.
  • Specified high clock rate: 2.133 GHz clock frequency provides a clear performance parameter for system timing and throughput considerations.
  • Low-voltage operation: 1.1 V supply supports designs targeting lower power consumption profiles.
  • Wide operating temperature: Rated from -30°C to 85°C for deployment in temperature-variable environments.
  • FBGA package format: Compact package designation in the product name supports board-level space considerations.

Why Choose MT53E2G32D4DT-046 WT:A TR?

The MT53E2G32D4DT-046 WT:A TR combines Mobile LPDDR4 SDRAM technology, a 64 Gbit density, and a specified 2.133 GHz clock frequency to deliver a clearly defined memory element for designs requiring substantial volatile storage at low voltage. Its 2G × 32 organization and FBGA package provide concrete integration characteristics for systems engineering and procurement.

This device is appropriate for engineers and procurement teams specifying low-voltage mobile LPDDR4 memory with explicit operating-temperature and clock-frequency requirements, offering predictable electrical and thermal parameters for system-level integration.

Request a quote or submit a pricing inquiry to receive availability and lead-time details for the MT53E2G32D4DT-046 WT:A TR. Sales and quotation teams can provide volume pricing and delivery options based on your project requirements.

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