NAND128W3A2BN6F TR

IC FLASH 128MBIT PARALLEL 48TSOP
Part Description

IC FLASH 128MBIT PARALLEL 48TSOP

Quantity 930 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOPMemory FormatFLASHTechnologyFLASH - NAND
Memory Size128 MbitAccess Time50 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page50 nsPackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of NAND128W3A2BN6F TR – 128 Mbit Parallel NAND Flash, 48‑TSOP

The NAND128W3A2BN6F TR is a 128 Mbit non-volatile FLASH NAND memory device organized as 16M × 8. It provides parallel memory access in a compact 48-TSOP package and is manufactured by Micron Technology Inc.

With a 50 ns access time, 50 ns write cycle time, a 2.7 V–3.6 V supply range and an operating temperature of -40°C to 85°C, this device targets designs that require deterministic parallel flash storage with defined electrical and thermal characteristics.

Key Features

  • Memory 128 Mbit capacity organized as 16M × 8, delivered as parallel FLASH NAND non-volatile memory.
  • Technology FLASH - NAND architecture provides non-volatile storage in a standard parallel format.
  • Performance 50 ns access time and 50 ns write cycle time (word/page) for predictable read/write timing.
  • Interface Parallel memory interface suitable for systems that use parallel flash connections.
  • Power Operates from 2.7 V to 3.6 V, matching common 3.3 V system rails.
  • Package 48-TFSOP / 48-TSOP package with 0.724" (18.40 mm) width for compact board-level integration.
  • Temperature Range Rated for operation from -40°C to 85°C (TA) to support designs that require extended temperature capability.

Typical Applications

  • Embedded Systems Parallel NAND flash storage for firmware and data in embedded controller and microprocessor designs.
  • Consumer Electronics On-board non-volatile memory for devices that use parallel flash architectures.
  • Industrial Equipment Non-volatile storage option for equipment requiring operation across -40°C to 85°C.

Unique Advantages

  • Parallel interface for straightforward integration: Enables direct connection to systems designed for parallel flash memory.
  • Deterministic timing: 50 ns access and write cycle times provide predictable memory performance for timing-sensitive designs.
  • Wide supply range: 2.7 V–3.6 V operation supports compatibility with standard 3.3 V platforms.
  • Compact TSOP footprint: 48-TFSOP/48-TSOP package minimizes PCB area while preserving pin access for parallel connections.
  • Extended temperature operation: -40°C to 85°C rating supports use in temperature-challenging environments.

Why Choose NAND128W3A2BN6F TR?

The NAND128W3A2BN6F TR is positioned as a straightforward, specification-driven parallel NAND flash solution from Micron Technology Inc. Its 128 Mbit capacity, parallel interface, defined 50 ns timing, and 2.7 V–3.6 V supply range make it suitable for designs that require predictable non-volatile storage behavior in a compact 48-TSOP package.

This device is appropriate for engineers and procurement teams specifying parallel FLASH NAND for embedded, consumer, or industrial applications where clear electrical, timing, and temperature requirements are a priority.

Request a quote or contact sales to discuss pricing, availability, and sample requests for the NAND128W3A2BN6F TR.

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