NAND128W3AABN6E
| Part Description |
IC FLASH 128MBIT PAR 48TSOP I |
|---|---|
| Quantity | 1,639 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 50 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 50 ns | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 16M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of NAND128W3AABN6E – IC FLASH 128MBIT PAR 48TSOP I
The NAND128W3AABN6E is a 128 Mbit non-volatile Flash memory device using NAND technology with a parallel memory interface. It is organized as 16M × 8 and is supplied in a 48-pin TSOP package.
With a 50 ns access time, 50 ns write cycle time, a 2.7 V–3.6 V supply range, and an operating temperature range of −40 °C to 85 °C (TA), this device targets designs that require compact, parallel NAND flash storage with defined timing and electrical characteristics.
Key Features
- Memory Type and Architecture Non-volatile FLASH (NAND) memory organized as 16M × 8 for a total capacity of 128 Mbit.
- Interface Parallel memory interface for direct parallel access and integration with parallel memory controllers.
- Performance 50 ns access time and 50 ns write cycle time for consistent read and page write timing.
- Power Operates from a 2.7 V to 3.6 V supply range suitable for common 3.3 V systems.
- Package 48-TFSOP package (0.724", 18.40 mm width) supplied in a 48-TSOP I device package for board-level implementation.
- Temperature Range Specified operating ambient temperature of −40 °C to 85 °C (TA).
- Compliance Notice RoHS status not specified in the product data.
Typical Applications
- Parallel NAND flash storage systems For designs that require a 128 Mbit parallel NAND device for non-volatile data storage.
- Embedded memory modules Devices that need a 16M × 8 memory organization with defined access and write timings.
- Temperature-variant environments Systems operating within −40 °C to 85 °C that require stable NAND flash behavior across that range.
- 3.3 V system integration Designs powered within the 2.7 V–3.6 V range seeking a compact 48-pin TSOP NAND option.
Unique Advantages
- Deterministic timing: 50 ns access and write cycle times provide predictable performance for timing-sensitive designs.
- Parallel interface simplicity: Parallel memory interface allows straightforward connection to parallel controllers and processors.
- Standard memory organization: 16M × 8 layout simplifies addressing and capacity planning.
- Wide voltage compatibility: 2.7 V–3.6 V supply range supports common 3.3 V platforms.
- Wide operating temperature: −40 °C to 85 °C rating supports a broad range of ambient conditions.
- Compact TSOP packaging: 48-TFSOP / 48-TSOP I package with 18.40 mm width for efficient PCB placement.
Why Choose NAND128W3AABN6E?
NAND128W3AABN6E delivers a compact 128 Mbit NAND flash option with clear, verifiable electrical and timing specifications: 50 ns access time, 50 ns write cycle time, a 2.7 V–3.6 V supply window, and −40 °C to 85 °C operating range. Its 16M × 8 organization and parallel interface make it suitable where a defined parallel NAND memory solution is required.
Manufactured by Micron Technology Inc., the device is intended for designs that prioritize straightforward integration of parallel NAND flash in a 48-TSOP I package and need predictable performance and electrical characteristics for system planning and validation.
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