NAND128W3AABN6E

IC FLASH 128MBIT PAR 48TSOP I
Part Description

IC FLASH 128MBIT PAR 48TSOP I

Quantity 1,639 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size128 MbitAccess Time50 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page50 nsPackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of NAND128W3AABN6E – IC FLASH 128MBIT PAR 48TSOP I

The NAND128W3AABN6E is a 128 Mbit non-volatile Flash memory device using NAND technology with a parallel memory interface. It is organized as 16M × 8 and is supplied in a 48-pin TSOP package.

With a 50 ns access time, 50 ns write cycle time, a 2.7 V–3.6 V supply range, and an operating temperature range of −40 °C to 85 °C (TA), this device targets designs that require compact, parallel NAND flash storage with defined timing and electrical characteristics.

Key Features

  • Memory Type and Architecture  Non-volatile FLASH (NAND) memory organized as 16M × 8 for a total capacity of 128 Mbit.
  • Interface  Parallel memory interface for direct parallel access and integration with parallel memory controllers.
  • Performance  50 ns access time and 50 ns write cycle time for consistent read and page write timing.
  • Power  Operates from a 2.7 V to 3.6 V supply range suitable for common 3.3 V systems.
  • Package  48-TFSOP package (0.724", 18.40 mm width) supplied in a 48-TSOP I device package for board-level implementation.
  • Temperature Range  Specified operating ambient temperature of −40 °C to 85 °C (TA).
  • Compliance Notice  RoHS status not specified in the product data.

Typical Applications

  • Parallel NAND flash storage systems  For designs that require a 128 Mbit parallel NAND device for non-volatile data storage.
  • Embedded memory modules  Devices that need a 16M × 8 memory organization with defined access and write timings.
  • Temperature-variant environments  Systems operating within −40 °C to 85 °C that require stable NAND flash behavior across that range.
  • 3.3 V system integration  Designs powered within the 2.7 V–3.6 V range seeking a compact 48-pin TSOP NAND option.

Unique Advantages

  • Deterministic timing: 50 ns access and write cycle times provide predictable performance for timing-sensitive designs.
  • Parallel interface simplicity: Parallel memory interface allows straightforward connection to parallel controllers and processors.
  • Standard memory organization: 16M × 8 layout simplifies addressing and capacity planning.
  • Wide voltage compatibility: 2.7 V–3.6 V supply range supports common 3.3 V platforms.
  • Wide operating temperature: −40 °C to 85 °C rating supports a broad range of ambient conditions.
  • Compact TSOP packaging: 48-TFSOP / 48-TSOP I package with 18.40 mm width for efficient PCB placement.

Why Choose NAND128W3AABN6E?

NAND128W3AABN6E delivers a compact 128 Mbit NAND flash option with clear, verifiable electrical and timing specifications: 50 ns access time, 50 ns write cycle time, a 2.7 V–3.6 V supply window, and −40 °C to 85 °C operating range. Its 16M × 8 organization and parallel interface make it suitable where a defined parallel NAND memory solution is required.

Manufactured by Micron Technology Inc., the device is intended for designs that prioritize straightforward integration of parallel NAND flash in a 48-TSOP I package and need predictable performance and electrical characteristics for system planning and validation.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for the NAND128W3AABN6E.

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