NAND128W3A0BN6F TR

IC FLASH 128MBIT PARALLEL 48TSOP
Part Description

IC FLASH 128MBIT PARALLEL 48TSOP

Quantity 1,536 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOPMemory FormatFLASHTechnologyFLASH - NAND
Memory Size128 MbitAccess Time50 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page50 nsPackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of NAND128W3A0BN6F TR – IC FLASH 128MBIT PARALLEL 48TSOP

The NAND128W3A0BN6F TR is a 128 Mbit non-volatile NAND flash memory organized as 16M × 8. It provides parallel interface access in a 48-lead TSOP package for designs that require moderate-density, parallel-access storage.

Designed to operate from a 2.7 V to 3.6 V supply and across a temperature range of -40°C to 85°C, this device is intended for systems that need a compact flash memory solution with defined timing characteristics and a standard TSOP footprint.

Key Features

  • Memory Core 128 Mbit NAND flash organized as 16M × 8, providing non-volatile storage in a compact footprint.
  • Technology FLASH - NAND non-volatile memory technology suitable for persistent data and code storage requirements.
  • Interface & Timing Parallel memory interface with access time of 50 ns and a word/page write cycle time of 50 ns for deterministic timing behavior.
  • Power Operates from a supply voltage range of 2.7 V to 3.6 V, compatible with common 3.0 V system rails.
  • Package Available in a 48-TFSOP / 48-TSOP package (0.724", 18.40 mm width) for standard TSOP board layouts.
  • Temperature Range Specified for operation from -40°C to 85°C (TA), supporting extended temperature applications within that range.

Typical Applications

  • Embedded systems with parallel storage — Provides 128 Mbit of non-volatile memory via a parallel interface for systems that require direct parallel access.
  • Firmware and code storage — Stores firmware or boot code in a 16M × 8 NAND organization suitable for fixed-content memory requirements.
  • Data buffering and logging — Offers non-volatile storage for data retention across power cycles within the specified supply and temperature ranges.

Unique Advantages

  • Compact TSOP footprint: The 48-TSOP (48-TFSOP) package supports standard board layouts while keeping board area compact.
  • Deterministic timing: 50 ns access time and 50 ns write-cycle timing provide clear timing parameters for system design and integration.
  • Wide supply tolerance: Operation from 2.7 V to 3.6 V aligns with common 3.0 V system rails for straightforward power integration.
  • Broad operating temperature: Rated from -40°C to 85°C to accommodate designs that require extended temperature operation within this range.
  • Standard memory organization: 16M × 8 layout simplifies address and data bus integration in parallel-memory architectures.

Why Choose NAND128W3A0BN6F TR?

The NAND128W3A0BN6F TR positions itself as a straightforward 128 Mbit parallel NAND flash memory option with defined timing, a standard TSOP package, and a supply and temperature range that match many embedded system requirements. Its 16M × 8 organization and 50 ns access/write timings make it suitable for designs that need predictable parallel flash behavior.

Manufactured by Micron Technology Inc., this device is appropriate for engineers specifying non-volatile parallel memory in compact board layouts where the stated voltage, timing, and temperature specifications meet system needs.

Request a quote or contact sales to submit a quote for the NAND128W3A0BN6F TR and discuss availability and volume pricing for your design requirements.

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