NAND128W3AABN6F TR

IC FLASH 128MBIT PAR 48TSOP I
Part Description

IC FLASH 128MBIT PAR 48TSOP I

Quantity 786 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size128 MbitAccess Time50 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page50 nsPackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of NAND128W3AABN6F TR – 128 Mbit NAND Flash, Parallel, 48‑TSOP I

The NAND128W3AABN6F TR is a 128 Mbit non-volatile NAND flash memory device manufactured by Micron Technology Inc. It implements a parallel memory interface in a 16M × 8 organization and is supplied in a 48‑TSOP I package.

With a 50 ns access time, 50 ns write cycle time (word/page), a 2.7 V–3.6 V supply range and an operating temperature range of −40°C to 85°C, the device is specified for systems that require parallel NAND flash memory in a compact TSOP footprint.

Key Features

  • Memory Type & Capacity  128 Mbit NAND flash organized as 16M × 8, providing non-volatile storage in a parallel memory format.
  • Performance  50 ns access time and 50 ns write cycle time (word/page) for read/write operations.
  • Interface  Parallel memory interface suitable for designs that use parallel data buses.
  • Voltage Supply  Operates from 2.7 V to 3.6 V.
  • Temperature Range  Rated for operation from −40°C to 85°C (TA).
  • Package  48‑TSOP I package (48‑TFSOP, 0.724" / 18.40 mm width) for compact PCB implementation.

Unique Advantages

  • 128 Mbit density: Provides a 16M × 8 organization for moderate-density non-volatile storage.
  • Deterministic timing: 50 ns access and 50 ns write cycle times give clear timing parameters for system design.
  • Parallel bus compatibility: Parallel interface supports integration into designs that use parallel memory architectures.
  • Flexible power range: 2.7 V–3.6 V supply enables use in typical 3.3 V systems.
  • Wide operating temperature: −40°C to 85°C rating supports applications across a broad thermal envelope.
  • Compact TSOP footprint: 48‑TSOP I (0.724", 18.40 mm width) package conserves board space while providing standard TSOP pinout.

Why Choose IC FLASH 128MBIT PAR 48TSOP I?

This Micron-manufactured NAND128W3AABN6F TR device combines 128 Mbit NAND flash capacity with defined 50 ns read/write timings, a parallel interface, and a compact 48‑TSOP I package. The electrical and thermal specifications—2.7 V–3.6 V supply and −40°C to 85°C operating range—make it a straightforward option for designs that require a parallel NAND flash memory with known, verifiable parameters.

The device is suited to engineers and procurement teams seeking a parallel NAND flash component with clear organization and package details for integration into existing parallel bus architectures and space-constrained PCBs.

Request a quote or submit an inquiry to receive pricing and availability for the NAND128W3AABN6F TR.

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