NAND256W3A2BN6F

The NAND256W3A2BN6F is a 256 Mbit non-volatile flash memory organized as 32M × 8 and implemented in NAND flash technology. It provides parallel memory access and is packaged in a 48‑TSOP (48‑TFSOP) package with an 18.40 mm width.

Designed for systems that require parallel NAND storage with a compact board‑level footprint, this device offers 50 ns access and write cycle timing and operates from a 2.7 V to 3.6 V supply over an ambient temperature range of −40 °C to 85 °C.

Key Features

• Memory Core  256 Mbit NAND flash organized as 32M × 8 for byte-oriented storage.
• Memory Technology  Non‑volatile FLASH (NAND) providing persistent data retention without power.
• Interface  Parallel memory interface for direct system bus connection and byte‑wide data transfers.
• Performance  50 ns access time and 50 ns write cycle time (word/page) for read/write responsiveness.
• Power  Wide supply range from 2.7 V to 3.6 V to accommodate common 3 V system rails.
• Package  48‑TFSOP (48‑TSOP) package with 0.724" (18.40 mm) width for board mounting.
• Operating Range  Ambient operating temperature from −40 °C to 85 °C for extended temperature applications.

Typical Applications

• Embedded system storage  Parallel NAND flash for program code and persistent data storage in embedded designs requiring a byte‑wide interface.
• Firmware and boot code  Non‑volatile storage of firmware and boot sequences where parallel access and 32M × 8 organization are required.
• Board‑level data storage  Compact 48‑TSOP package suited to board‑level integration for systems needing up to 256 Mbit of NAND storage.

Unique Advantages

• Parallel interface compatibility: Simplifies integration with systems that use byte‑wide parallel memory buses, reducing interface complexity.
• Predictable timing: 50 ns access and write cycle times enable straightforward timing budgets for read and write operations.
• Flexible power range: 2.7 V to 3.6 V supply range supports common 3 V system architectures and enables use across varied power domains.
• Compact board footprint: 48‑TSOP (48‑TFSOP) package provides a standardized form factor for dense board layouts.
• Extended temperature operation: −40 °C to 85 °C ambient rating supports deployment in environments with a wide temperature span.

Why Choose IC FLASH 256MBIT PARALLEL 48TSOP?

The NAND256W3A2BN6F positions itself as a practical parallel NAND flash option where a 256 Mbit capacity, byte‑wide organization (32M × 8), and 50 ns timing are required. Its 2.7 V to 3.6 V supply range and extended ambient temperature rating make it suitable for designs that require stable non‑volatile storage across a variety of operating conditions.

This device is well suited to engineers implementing board‑level storage for firmware, boot code, or application data who need a compact 48‑TSOP package and direct parallel interface. The combination of specifications supports predictable integration and straightforward timing and power planning in system designs.

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