W9412G6KH-4
| Part Description |
IC DRAM 128MBIT SSTL2 66TSOP II |
|---|---|
| Quantity | 562 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 48 ns | Grade | Commercial | ||
| Clock Frequency | 250 MHz | Voltage | 2.4V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | SSTL_2 | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of W9412G6KH-4 – IC DRAM 128MBIT SSTL2 66TSOP II
The W9412G6KH-4 is a 128 Mbit DDR SDRAM device from Winbond Electronics, organized as 8M × 16 and implemented as volatile DRAM. It provides synchronous DDR memory with an SSTL_2 memory interface in a compact 66-TSSOP / 66-TSOP II package.
Designed for systems that require synchronous DDR storage, the device offers a 250 MHz input clock frequency, a 2.4 V–2.7 V supply range, and timing characteristics suitable for burst read/write operations and standard DDR command sequences.
Key Features
- Memory Core DDR SDRAM volatile memory, 128 Mbit total capacity organized as 8M × 16.
- Interface SSTL_2 memory interface for signaling compatible designs.
- Performance & Timing Clock frequency rated at 250 MHz, access time specified at 48 ns, and a write cycle time (word page) of 12 ns.
- Supply Voltage Operates from a 2.4 V to 2.7 V supply range.
- Package Available in a 66-TSSOP (0.400", 10.16 mm width) / 66-TSOP II package for compact board-level integration.
- Temperature Range Specified operating ambient temperature range: 0°C to 70°C (TA).
- DDR Functional Support Datasheet lists standard DDR command functions including Bank Activate, Precharge, Read, Write, Mode Register Set, Auto Refresh and Self Refresh.
Typical Applications
- System Memory Volatile DDR storage for systems that require 128 Mbit synchronous memory with an SSTL_2 interface.
- FPGA / ASIC External Memory External x16 DDR memory option for designs using SSTL_2 signaling and requiring compact TSOP packaging.
- Controller Buffering Temporary data storage and buffering in controllers and memory subsystems where DDR timing and burst access are used.
Unique Advantages
- Compact 66-TSOP II footprint: Enables integration into space-constrained PCBs with a 0.400" (10.16 mm) width package.
- SSTL_2 signaling support: Matches designs that require SSTL_2 interface levels for DDR memory interconnects.
- DDR command support: Includes standard DDR command set (Mode Register Set, Auto Refresh, Self Refresh, etc.) as documented in the datasheet for predictable memory control.
- Deterministic timing: Published clock frequency (250 MHz), access time (48 ns), and write cycle timing (12 ns) facilitate timing analysis and system integration.
- Standard operating voltage: 2.4 V–2.7 V supply range aligns with common DDR power domains.
Why Choose W9412G6KH-4?
The W9412G6KH-4 positions itself as a straightforward 128 Mbit DDR SDRAM option for designs that require SSTL_2 signaling, defined timing parameters, and a compact 66-TSOP II package. Its documented DDR command support and published electrical/timing characteristics simplify system integration and timing validation.
This device is suitable for engineering teams and procurement looking for a verified DDR memory component with clear supply and temperature specifications, and compact board-level packaging for constrained layouts.
Request a quote or submit a parts inquiry to obtain pricing and availability information for the W9412G6KH-4.