W9412G6KH-4

IC DRAM 128MBIT SSTL2 66TSOP II
Part Description

IC DRAM 128MBIT SSTL2 66TSOP II

Quantity 562 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size128 MbitAccess Time48 nsGradeCommercial
Clock Frequency250 MHzVoltage2.4V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceSSTL_2Memory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9412G6KH-4 – IC DRAM 128MBIT SSTL2 66TSOP II

The W9412G6KH-4 is a 128 Mbit DDR SDRAM device from Winbond Electronics, organized as 8M × 16 and implemented as volatile DRAM. It provides synchronous DDR memory with an SSTL_2 memory interface in a compact 66-TSSOP / 66-TSOP II package.

Designed for systems that require synchronous DDR storage, the device offers a 250 MHz input clock frequency, a 2.4 V–2.7 V supply range, and timing characteristics suitable for burst read/write operations and standard DDR command sequences.

Key Features

  • Memory Core  DDR SDRAM volatile memory, 128 Mbit total capacity organized as 8M × 16.
  • Interface  SSTL_2 memory interface for signaling compatible designs.
  • Performance & Timing  Clock frequency rated at 250 MHz, access time specified at 48 ns, and a write cycle time (word page) of 12 ns.
  • Supply Voltage  Operates from a 2.4 V to 2.7 V supply range.
  • Package  Available in a 66-TSSOP (0.400", 10.16 mm width) / 66-TSOP II package for compact board-level integration.
  • Temperature Range  Specified operating ambient temperature range: 0°C to 70°C (TA).
  • DDR Functional Support  Datasheet lists standard DDR command functions including Bank Activate, Precharge, Read, Write, Mode Register Set, Auto Refresh and Self Refresh.

Typical Applications

  • System Memory  Volatile DDR storage for systems that require 128 Mbit synchronous memory with an SSTL_2 interface.
  • FPGA / ASIC External Memory  External x16 DDR memory option for designs using SSTL_2 signaling and requiring compact TSOP packaging.
  • Controller Buffering  Temporary data storage and buffering in controllers and memory subsystems where DDR timing and burst access are used.

Unique Advantages

  • Compact 66-TSOP II footprint: Enables integration into space-constrained PCBs with a 0.400" (10.16 mm) width package.
  • SSTL_2 signaling support: Matches designs that require SSTL_2 interface levels for DDR memory interconnects.
  • DDR command support: Includes standard DDR command set (Mode Register Set, Auto Refresh, Self Refresh, etc.) as documented in the datasheet for predictable memory control.
  • Deterministic timing: Published clock frequency (250 MHz), access time (48 ns), and write cycle timing (12 ns) facilitate timing analysis and system integration.
  • Standard operating voltage: 2.4 V–2.7 V supply range aligns with common DDR power domains.

Why Choose W9412G6KH-4?

The W9412G6KH-4 positions itself as a straightforward 128 Mbit DDR SDRAM option for designs that require SSTL_2 signaling, defined timing parameters, and a compact 66-TSOP II package. Its documented DDR command support and published electrical/timing characteristics simplify system integration and timing validation.

This device is suitable for engineering teams and procurement looking for a verified DDR memory component with clear supply and temperature specifications, and compact board-level packaging for constrained layouts.

Request a quote or submit a parts inquiry to obtain pricing and availability information for the W9412G6KH-4.

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