W9412G6KH-5 TR

IC DRAM 128MBIT SSTL2 66TSOP II
Part Description

IC DRAM 128MBIT SSTL2 66TSOP II

Quantity 398 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size128 MbitAccess Time50 nsGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceSSTL_2Memory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9412G6KH-5 TR – IC DRAM 128MBIT SSTL2 66TSOP II

The W9412G6KH-5 TR is a 128 Mbit DDR SDRAM device organized as 8M × 16 with an SSTL_2 memory interface in a 66-TSSOP (66-TSOP II) package. It implements synchronous DDR SDRAM architecture (2M × 4 banks × 16 bits as documented in the datasheet) for board-level volatile memory applications.

Designed for systems requiring a compact, board-mount DDR memory solution, the device supports a 200 MHz clock frequency, a 2.3V–2.7V supply range, and standard DDR command and timing functionality as detailed in the Winbond datasheet (Rev A03).

Key Features

  • Memory Architecture  128 Mbit DRAM organized as 8M × 16 with multiple internal banks (2M × 4 banks × 16 bits as documented), providing standard DDR SDRAM structure for burst access and banked operations.
  • DDR SDRAM Technology  Synchronous DDR SDRAM device with standard DDR command set and functional blocks (activate, precharge, read, write, refresh, mode register operations) as described in the datasheet.
  • Interface  SSTL_2 memory interface for DDR signaling compatibility; supports DDR signaling and timing conventions as specified in the device documentation.
  • Performance  Clock frequency up to 200 MHz and an access time of 50 ns, with write cycle time (word/page) specified at 15 ns for timing-aware designs.
  • Supply Voltage  Operates from 2.3 V to 2.7 V, enabling integration into systems using standard DDR supply rails.
  • Package  66-TSSOP (0.400", 10.16 mm width) surface-mount package (66-TSOP II) for compact board-level mounting and standard assembly processes.
  • Operating Temperature  Specified operating ambient temperature range of 0°C to 70°C (TA) for standard commercial environments.

Typical Applications

  • Board-level DDR memory  Use as on-board volatile memory where a 128 Mbit DDR SDRAM in a 66-TSSOP footprint is required.
  • System buffering and working memory  Suitable for designs needing synchronous DDR data buffering with SSTL_2 signaling and burst-read/write operations.
  • Memory expansion for embedded systems  Fits compact PCBs that require a surface-mount DRAM device with standard DDR command/timing support.

Unique Advantages

  • Compact surface-mount footprint: 66-TSSOP (66-TSOP II) package provides a space-efficient form factor for dense board layouts.
  • SSTL_2 interface compatibility: Native SSTL_2 signaling support aligns with DDR interface requirements for controlled signaling environments.
  • Documented DDR command and timing support: Datasheet (Rev A03) details power-up sequence, command set, mode registers, refresh, and timing waveforms to aid integration and validation.
  • Standard DDR operating parameters: 200 MHz clock frequency support, 50 ns access time, and 15 ns write cycle time provide clear performance figures for system timing budgets.
  • Wide commercial supply range: 2.3 V to 2.7 V supply compatibility supports common DDR power rails.

Why Choose IC DRAM 128MBIT SSTL2 66TSOP II?

The W9412G6KH-5 TR provides a documented DDR SDRAM solution in a compact 66-TSSOP package, offering clear electrical and timing parameters (200 MHz clock, 50 ns access time, 2.3–2.7 V supply) for system designers. Its SSTL_2 interface and standard DDR command/timing behavior make it suitable for board-level memory implementations requiring predictable DDR operation.

This device is appropriate for designs that need a 128 Mbit volatile DDR memory with available datasheet guidance (Winbond Rev A03) for power-up, command sequences, and timing integration. It delivers straightforward integration where package footprint, supply range, and timing specifications are primary selection criteria.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the W9412G6KH-5 TR.

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