W9464G6KH-5I TR
| Part Description |
IC DRAM 64MBIT PAR 66TSOP II |
|---|---|
| Quantity | 482 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 55 ns | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of W9464G6KH-5I TR – IC DRAM 64MBIT PAR 66TSOP II
The W9464G6KH-5I TR from Winbond Electronics is a 64 Mbit DDR SDRAM organized as 4M × 16 with a parallel memory interface. It implements DDR SDRAM architecture with internal bank structure described as 1M × 4 banks × 16 bits and is supplied in a 66-TSSOP / 66-TSOP II package.
This device is intended for system designs that require a compact, low-voltage parallel DDR memory solution operating at up to 200 MHz, with documented timing and operational details provided in the manufacturer datasheet.
Key Features
- Memory Type & Technology Volatile DRAM using DDR SDRAM technology for double-data-rate transfers.
- Memory Organization 64 Mbit capacity arranged as 4M × 16 (datasheet describes internal organization as 1M × 4 banks × 16 bits).
- Interface Parallel memory interface compatible with standard DDR command set and timing (commands and register operations detailed in the datasheet).
- Performance Clock frequency rated to 200 MHz with an access time of 55 ns and a word/page write cycle time of 15 ns (timing parameters and waveforms specified in the datasheet).
- Power Operates from a 2.3 V to 2.7 V supply range.
- Temperature Range Specified operating ambient temperature: -40°C to 85°C (TA).
- Package 66-TSSOP (0.400", 10.16 mm width) / 66-TSOP II package for high-density PCB mounting.
- Documentation Comprehensive datasheet includes power-up sequence, command set, timing waveforms, electrical characteristics and system notes for DDR SDRAM integration.
Typical Applications
- Parallel DDR memory subsystems Use as a 64 Mbit DDR SDRAM component where a parallel memory interface and documented DDR timing are required.
- Embedded system designs Suitable for embedded systems that need a compact TSOP II package and operation across a -40°C to 85°C ambient range.
- Low-voltage memory designs Applicable in systems designed around a 2.3 V to 2.7 V DDR supply rail.
Unique Advantages
- Compact 66-TSOP II packaging: 66-TSSOP (0.400", 10.16 mm width) minimizes board area while providing a standard footprint for surface-mount assembly.
- Documented DDR operation: Datasheet provides detailed command functions, timing waveforms, and electrical characteristics to support system integration and validation.
- Balanced performance: 200 MHz clock frequency with 55 ns access time and 15 ns word/page write cycle time delivers defined DDR timing for predictable system behavior.
- Wide ambient range: Specified operation from -40°C to 85°C supports deployment across a broad set of temperature environments.
- Low-voltage operation: 2.3 V to 2.7 V supply range aligns with low-voltage DDR system designs.
Why Choose IC DRAM 64MBIT PAR 66TSOP II?
The W9464G6KH-5I TR is positioned as a straightforward 64 Mbit DDR SDRAM component for designs requiring a parallel DDR memory interface, compact 66-TSOP II packaging, and defined timing characteristics. Its documented organization (4M × 16 / 1M × 4 banks × 16 bits), electrical parameters, and timing details make it suitable for engineers who need verifiable DDR SDRAM behavior for system integration.
This device is appropriate for designs that prioritize a specified 200 MHz clock operation, 2.3–2.7 V supply compatibility, and operation across -40°C to 85°C. The availability of a comprehensive datasheet from the manufacturer supports design validation, timing analysis, and reliable implementation into target systems.
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