W9751G6KB-18
| Part Description |
IC DRAM 512MBIT PAR 84WBGA |
|---|---|
| Quantity | 843 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 84-WBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 58.13 ns | Grade | Commercial (Extended) | ||
| Clock Frequency | 533 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 85°C (TC) | Write Cycle Time Word Page | 15 ns | Packaging | 84-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of W9751G6KB-18 – IC DRAM 512MBIT PAR 84WBGA
The W9751G6KB-18 is a 512 Mbit DDR2 SDRAM device with a parallel memory interface configured as 32M × 16. It implements DDR2 architecture with multi-bank organization and is supplied in an 84-ball WBGA package.
Designed for systems that require parallel DDR2 memory, the device delivers operation at a 533 MHz clock rate (–18 speed grade) with support for standard DDR2 control features such as on-die termination, mode/extended mode registers, and power-down/self-refresh modes.
Key Features
- Memory Core 512 Mbit DDR2 SDRAM organized as 32M × 16 with multi-bank architecture (8M × 4 banks × 16 bit).
- Performance Supports a 533 MHz clock frequency (–18 speed grade) with a specified access time of 58.13 ns and a write cycle time (word/page) of 15 ns.
- Interface Parallel DDR2 memory interface suitable for standard DDR2 command/clock operation and burst modes.
- Power Operates from a 1.7 V to 1.9 V supply range and includes power management features described in the product documentation (self-refresh and power-down modes).
- System and Control Features Supports Mode Register Set (MRS) and Extended Mode Registers (EMR) operations, DLL enable/disable and On-Die Termination (ODT) functions as documented in the device manual.
- Package and Thermal Supplied in an 84-ball TFBGA/WBGA footprint (84-TFBGA / 84-WBGA, package outline 8 × 12.5 mm) with an operating temperature range of 0 °C to 85 °C (TC).
Typical Applications
- Parallel DDR2 memory subsystems — Used where a compact, parallel DDR2 DRAM component is required for system memory arrays or memory expansion boards.
- Embedded systems — Suitable for embedded designs that require a 512 Mbit DDR2 device with standard DDR2 control features and power management.
- Memory module and board-level designs — Applicable for integration into custom memory modules or board-level implementations using an 84-ball WBGA footprint.
Unique Advantages
- Compact WBGA footprint: 84-ball package (8 × 12.5 mm) enables high-density board layouts while maintaining standard BGA assembly compatibility.
- Standard DDR2 feature set: On-die termination (ODT), DLL control and extended mode registers provide flexible timing and signal integrity options for system designers.
- Verified timing for –18 speed grade: AC characteristics and timing parameters documented for the 533 MHz (–18) grade support deterministic performance planning.
- Low-voltage operation: 1.7 V to 1.9 V supply range reduces system power budget compared to higher-voltage memory alternatives within the DDR2 family.
- Power management modes: Self-refresh and power-down capabilities (documented in the datasheet) help reduce standby current in inactive states.
Why Choose W9751G6KB-18?
The W9751G6KB-18 provides a concise DDR2 SDRAM solution for designs requiring a 512 Mbit parallel memory device with documented timing for the –18 (533 MHz) speed grade. Its combination of standard DDR2 control features (ODT, EMR, DLL), low-voltage operation, and a compact 84-ball WBGA package make it suitable for board-level memory integration where footprint and deterministic timing are important.
This device is well suited for engineers and procurement teams specifying parallel DDR2 memory in embedded systems or custom memory modules who need clear electrical and timing specifications and documented control options in the device datasheet.
Request a quote or submit an inquiry for W9751G6KB-18 to receive pricing, availability, and technical assistance for your design requirements.