W9751G6KB-25
| Part Description |
IC DRAM 512MBIT PARALLEL 84WBGA |
|---|---|
| Quantity | 1,048 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 84-WBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 57.5 ns | Grade | Commercial (Extended) | ||
| Clock Frequency | 400 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 85°C (TC) | Write Cycle Time Word Page | 15 ns | Packaging | 84-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of W9751G6KB-25 – IC DRAM 512MBIT PARALLEL 84WBGA
The W9751G6KB-25 from Winbond Electronics is a 512 Mbit DDR2 SDRAM device in a parallel memory interface, packaged in an 84-ball WBGA. It implements a 32M × 16 memory organization (documented as 8M × 4 banks × 16-bit in the datasheet) and is designed for applications requiring standard DDR2 SDRAM functionality in a compact BGA footprint.
Key electrical and timing characteristics include a 400 MHz clock rating, 1.7 V–1.9 V supply range, a 15 ns write-cycle time (word/page) and an access time listed as 57.5 ns. The device is specified for commercial operating temperatures from 0 °C to 85 °C.
Key Features
- DDR2 SDRAM Technology Standard DDR2 SDRAM architecture with support for burst read/write operations and parallel data interface.
- Memory Capacity & Organization 512 Mbit total capacity implemented as 32M × 16; datasheet describes an 8M × 4 banks × 16-bit bank architecture for command and bank management.
- Performance Clock rating up to 400 MHz and documented access time of 57.5 ns, with a write cycle time (word/page) of 15 ns.
- Power Low-voltage DDR2 operation with a supply range of 1.7 V to 1.9 V.
- Package & Mounting 84-ball WBGA package (84-TFBGA / 84-WBGA, 8 × 12.5 mm) designed for surface-mount PCB assembly.
- Command, Timing & Control Supports Mode Register and Extended Mode Register programming, On-Die Termination (ODT), DLL enable/disable, and the full DDR2 command set (activate, read, write, precharge, refresh, power-down, self-refresh).
- Operational Range Specified operating temperature range of 0 °C to 85 °C (TC) for commercial-temperature applications.
Typical Applications
- DDR2 memory for system designs Use as parallel DDR2 SDRAM memory in systems that require a 512 Mbit density in a compact WBGA package.
- Legacy platform support Replacement or maintenance of systems designed around parallel DDR2 SDRAM memory interfaces.
- Embedded and industrial-class equipment (commercial range) Board-level memory expansion where 1.7 V–1.9 V DDR2 operation and a 0 °C–85 °C operating range are acceptable.
Unique Advantages
- 512 Mbit density in a compact BGA: Provides significant memory capacity while minimizing PCB area with an 84-ball WBGA footprint.
- Standard DDR2 feature set: Mode registers, extended mode registers, ODT and DLL controls provide flexible timing and termination configuration for system tuning.
- Low-voltage operation: 1.7 V–1.9 V supply range aligns with DDR2 power domains to reduce system power budget and simplify supply requirements.
- Documented timing and commands: Datasheet includes detailed command, timing, and electrical specifications (activate/read/write/precharge/refresh, power-down/self-refresh) to support deterministic design validation.
- Commercial temperature rating: Specified for 0 °C to 85 °C operation, suitable for a wide range of non-automotive electronics applications.
Why Choose W9751G6KB-25?
The W9751G6KB-25 delivers 512 Mbit of DDR2 SDRAM capacity in a compact 84-WBGA package with a full complement of DDR2 control, timing and termination features documented in the manufacturer datasheet. Its combination of 32M × 16 organization, 8M × 4 banks architecture, and supported mode/extended mode register controls makes it suitable for designs that require standard DDR2 functionality with configurable termination and timing.
This device is appropriate for engineers and procurement teams seeking a documented DDR2 memory IC from Winbond Electronics for commercial-temperature applications. The detailed datasheet provides the electrical, timing and command-level information needed for system integration and validation.
Request a quote or submit a product inquiry to obtain pricing and availability for the W9751G6KB-25.