W9751G8KB25I TR
| Part Description |
IC DRAM 512MBIT PARALLEL 60WBGA |
|---|---|
| Quantity | 480 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-WBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 57.5 ns | Grade | Automotive | ||
| Clock Frequency | 400 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of W9751G8KB25I TR – IC DRAM 512MBIT PARALLEL 60WBGA
The W9751G8KB25I TR is a 512 Mbit DDR2 SDRAM device in a compact 60-WBGA (8 × 12.5 mm) package. It implements a 64M × 8 memory organization with a parallel DDR2 interface and supports an external clock frequency up to 400 MHz.
Manufactured by Winbond Electronics, this device includes DDR2 functional features such as mode registers, on-die termination (ODT) support and DLL control, and operates over a wide supply and temperature range suitable for board-level memory implementations that require a low-voltage DDR2 solution.
Key Features
- Memory Core DDR2 SDRAM architecture providing 512 Mbit density implemented as 64M × 8 organization.
- Internal Organization Internal arrangement noted in documentation as 16M × 4 banks × 8-bit, consistent with the 64M × 8 organization.
- Performance Supports a clock frequency up to 400 MHz with an access time of 57.5 ns and a write cycle time (word/page) of 15 ns.
- Interface & Modes Parallel DDR2 interface with standard DDR2 command and burst modes; datasheet documents Mode Register Set (MRS), Extended Mode Registers (EMRS), burst read/write and auto-precharge operation.
- On-Die Features Includes on-die termination (ODT) and DLL enable/disable controls as described in the device functional sections of the datasheet.
- Power Low-voltage operation with recommended supply range of 1.7 V to 1.9 V.
- Package & Temperature 60-TFBGA / 60-WBGA (8 × 12.5 mm) package; operating temperature range −40 °C to 95 °C (TC).
- Power Management Supports power-down and self-refresh commands as described in the functional description sections of the datasheet.
Typical Applications
- Board-level DDR2 memory expansion — Provides 512 Mbit parallel DDR2 in a 60-WBGA footprint for compact PCB designs requiring additional DRAM density.
- Space-constrained systems — Low-profile BGA packaging and high density suit small form-factor hardware where board area is limited.
- Low-voltage designs — 1.7 V–1.9 V supply range supports designs targeting lower DDR2 power domains.
Unique Advantages
- High density in a compact package: 512 Mbit capacity in a 60-WBGA (8 × 12.5 mm) package minimizes board area for high-density memory requirements.
- DDR2 feature set: Built-in support for DDR2 mode registers, EMRS, ODT and DLL control enables standard DDR2 command sequences and advanced timing configurations described in the datasheet.
- Performance at 400 MHz clock: Specified support up to 400 MHz with documented access and cycle timing (57.5 ns access time, 15 ns write cycle time) for predictable timing integration.
- Wide operating temperature: −40 °C to 95 °C operating range supports deployments across varied thermal environments.
- Low-voltage operation: 1.7 V–1.9 V supply reduces interface power relative to higher-voltage memories when used within specified conditions.
Why Choose IC DRAM 512MBIT PARALLEL 60WBGA?
The W9751G8KB25I TR positions itself as a compact, low-voltage DDR2 memory option offering 512 Mbit density and a full DDR2 feature set (mode registers, ODT, DLL control, power-down and self-refresh). Its documented timing parameters and 400 MHz clock support enable deterministic integration into systems that require parallel DDR2 memory with defined performance characteristics.
This device is suitable for designers seeking a board-level DDR2 DRAM solution in a 60-WBGA package with an extended operating temperature range and low-voltage supply window, backed by the functional and electrical detail provided in the product datasheet for system integration and validation.
If you would like pricing, availability or a formal quote for W9751G8KB25I TR, request a quote or submit a product inquiry and our team will respond with the required procurement details.