W9751G8NB-25 TR

IC DRAM 512MBIT PAR 60VFBGA
Part Description

IC DRAM 512MBIT PAR 60VFBGA

Quantity 962 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package60-VFBGA (8x9.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time57.5 nsGradeCommercial (Extended)
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature0°C ~ 85°C (TC)Write Cycle Time Word Page15 nsPackaging60-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of W9751G8NB-25 TR – IC DRAM 512MBIT PAR 60VFBGA

The W9751G8NB-25 TR is a 512 Mbit DDR2 SDRAM device from Winbond Electronics, organized as 64M × 8 with 16M × 4 banks × 8-bit architecture. It provides a parallel DDR2 memory interface operating at a clock frequency of up to 400 MHz and is supplied at 1.7 V to 1.9 V.

This device targets designs that require medium-density, synchronous DRAM storage with standard DDR2 features such as mode registers, on-die termination (ODT), DLL control and power-down/self-refresh functionality, delivered in a 60-ball VFBGA package (8 × 9.5 mm).

Key Features

  • Memory Core 512 Mbit DDR2 SDRAM organized as 64M × 8 with 16M × 4 banks × 8-bit architecture, suitable for parallel memory systems.
  • Performance Supports a clock frequency up to 400 MHz, with a specified access time of 57.5 ns and a write cycle time (word page) of 15 ns.
  • Voltage and Power Operates from a 1.7 V to 1.9 V supply range and includes power management modes described in the device functional description, including power-down and self-refresh.
  • Memory Control and Timing Supports Mode Register Set (MRS) and Extended Mode Register Set (EMRS) operations, DLL enable/disable, On-Die Termination (ODT) and Off-Chip Driver (OCD) impedance adjustment as documented in the device functional sections.
  • Data Transfer and Commands Standard DDR2 command set supported: bank activate, read/write (including burst read/write and auto-precharge), refresh, precharge and no-op commands with detailed timing and waveform specifications.
  • Package and Temperature Supplied in a 60-VFBGA package (8 × 9.5 mm) with an operating temperature range of 0°C to 85°C (TC).

Typical Applications

  • Embedded memory subsystems — Provides 512 Mbit of DDR2 parallel memory for embedded designs requiring synchronous DRAM with standard DDR2 control features.
  • Consumer and industrial electronics — Fits systems that operate within 0°C to 85°C and require a 60-VFBGA packaged DDR2 memory device at 1.7–1.9 V supply.
  • Memory expansion modules — Suitable for modular memory implementations using parallel DDR2 interfaces and 64M × 8 organization.

Unique Advantages

  • Compact BGA package: 60-VFBGA (8 × 9.5 mm) footprint enables space-efficient board layouts for compact system designs.
  • Synchronous DDR2 operation: 400 MHz clock capability and standard DDR2 command set support predictable timing and integration with DDR2-compatible controllers.
  • Flexible memory control: Mode registers, EMRS, ODT and OCD impedance adjustment provide configuration options to tune timing and signal integrity.
  • Power management features: Documented power-down and self-refresh modes support reduced-power operational states as defined in the functional description.
  • Defined electrical and timing parameters: Access time (57.5 ns) and write cycle time (15 ns) provide clear performance metrics for system timing design.

Why Choose W9751G8NB-25 TR?

The W9751G8NB-25 TR delivers a standardized DDR2 SDRAM solution with a 512 Mbit density, clear timing characteristics and comprehensive functional control (MRS/EMRS, ODT, OCD, DLL). Its 1.7–1.9 V supply range and 60-VFBGA package make it suitable for designs that need a compact, parallel DDR2 memory element with documented electrical and timing behavior.

This device is appropriate for engineers specifying medium-density DDR2 memory where predictable timing, configurable memory control and a small BGA footprint are required. The datasheet provides detailed command, timing and electrical specifications to support system integration and timing verification.

If you would like pricing, availability or to request a formal quote for the W9751G8NB-25 TR, please submit an inquiry or request a quote through our commercial channels.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up