W9812G6JB-6I TR

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 155 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9812G6JB-6I TR – IC DRAM 128MBIT PAR 54TFBGA

The W9812G6JB-6I TR from Winbond Electronics is a 128 Mbit synchronous DRAM (SDRAM) device organized as 2M words × 4 banks × 16 bits (8M × 16). It supports parallel SDRAM interface operation with a clock frequency up to 166 MHz and is offered in a 54-TFBGA (8×8) package.

Designed for applications that require deterministic parallel memory access and extended temperature operation, this device provides timing detail and operating modes (burst read/write, auto-precharge, self-refresh and power-down) documented in the manufacturer datasheet.

Key Features

  • Memory Architecture  Organized as 2M × 4 banks × 16 bits (8M × 16), providing a total density of 128 Mbit in a parallel SDRAM format.
  • Performance  Supports up to 166 MHz clock operation with an access time of 5 ns and CAS latency options documented in the datasheet for timing-sensitive designs.
  • Power  Operates from a 3.0 V to 3.6 V supply range, supporting common 3 V system rails.
  • Package  Available in a 54-TFBGA (8×8) package (supplier device package: 54-TFBGA), suitable for compact board-level integration.
  • Temperature Range  Industrial-grade device supported at an ambient operating temperature range of −40 °C to 85 °C (TA) for use in extended-temperature environments.
  • Supported SDRAM Commands and Modes  Documented support for bank activate, burst read/write, auto-precharge, precharge, self-refresh, power-down, and other SDRAM command sequences included in the datasheet.

Typical Applications

  • Embedded systems  Parallel SDRAM for microcontroller or FPGA-based systems requiring 128 Mbit memory with detailed timing control.
  • Industrial control  Memory for control and instrumentation equipment operating across −40 °C to 85 °C.
  • Networking and communications equipment  Parallel SDRAM for buffer and packet-processing functions where 166 MHz clocking and burst modes are used.

Unique Advantages

  • Deterministic parallel SDRAM interface: Parallel memory organization and documented command/timing sequences enable predictable read/write bursts and control.
  • 166 MHz data rate capability: High clock-frequency support with 5 ns access timing helps meet throughput requirements for time-sensitive designs.
  • Industrial temperature support: Rated for −40 °C to 85 °C ambient operation for deployments in extended-temperature environments.
  • Compact 54-TFBGA package: 8×8 TFBGA footprint simplifies board area planning while providing standard ball configuration for assembly.
  • Comprehensive datasheet coverage: Detailed functional description, timing waveforms, operating timing examples and electrical characteristics are provided to support integration and validation.

Why Choose W9812G6JB-6I TR?

The W9812G6JB-6I TR is positioned for designs that require a 128 Mbit parallel SDRAM solution with documented timing behavior and extended temperature capability. With up to 166 MHz clock support, a 3.0–3.6 V supply range, and an established set of SDRAM commands and operating modes, it is suited for embedded, industrial, and communications applications where predictable memory timing and industrial ambient performance are required.

Spec sheets and timing examples are available from the manufacturer to aid design, verification, and system integration, enabling engineering teams to plan board-level layout and memory timing accurately.

If you would like a quote or further pricing and availability information for the W9812G6JB-6I TR, please request a quote or contact sales for assistance.

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