W9812G6JH-6I
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 281 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of W9812G6JH-6I – IC DRAM 128Mbit Parallel 54-TSOP II
The W9812G6JH-6I is a high-speed synchronous DRAM (SDRAM) device from Winbond Electronics, organized as 2M × 4 banks × 16 bits for a total of 128 Mbit. It implements a parallel SDRAM interface and supports standard SDRAM command sets including burst read/write, auto-precharge, self-refresh and power-down modes.
This device is offered in the -6I industrial speed grade (compliant to 166 MHz / CAS Latency 3) and is targeted at personal computer and industrial applications that require board-level SDRAM capacity with an industrial operating temperature range.
Key Features
- Core Architecture Organized as 2M × 4 banks × 16 bits (equivalent to 8M × 16), providing 128 Mbit of SDRAM memory.
- SDRAM Performance Supports 166 MHz operation in the -6/-6I grade with CAS Latency = 3 and a typical access time of 5 ns.
- Burst and Command Support Implements standard SDRAM commands and modes including burst read/write, burst stop, auto-precharge, self-refresh, power-down and mode register programming as detailed in the datasheet.
- Parallel Memory Interface Parallel SDRAM interface suitable for synchronous board-level memory designs.
- Voltage Operates from 3.0 V to 3.6 V supply.
- Industrial Temperature Grade -6I grade is guaranteed for operation from -40°C to 85°C (TA).
- Package Supplied in a 54‑lead TSOP II package (0.400" / 10.16 mm width) for surface-mount board assembly.
Typical Applications
- Personal Computer Memory Meets personal computer industrial standard requirements for board-level SDRAM in computing platforms.
- Industrial Systems Industrial-grade temperature range (-40°C to 85°C) makes it suitable for industrial equipment requiring robust operating limits.
- Board-Level SDRAM Expansion Parallel interface and standard SDRAM command support enable use as on-board dynamic memory for embedded and system designs.
Unique Advantages
- Industrial Temperature Support: Guaranteed -40°C to 85°C operation for the -6I grade, addressing industrial ambient requirements.
- Standard SDRAM Command Set: Full support for burst operations, auto-precharge, self-refresh and power-down modes simplifies integration with standard memory controllers.
- Defined Performance Grade: -6I grade rated for 166 MHz operation with CAS Latency = 3, providing a clear performance target for system timing.
- Compact Surface-Mount Package: 54‑TSOP II package (10.16 mm width) enables compact PCB layouts for high-density memory implementations.
- <strong-Widely Documented: Detailed timing, command and electrical specifications are provided in the device datasheet to support system design and validation.
Why Choose W9812G6JH-6I?
The W9812G6JH-6I combines a standard parallel SDRAM architecture with industrial temperature capability and defined 166 MHz/CL3 performance, making it suitable for designers needing a documented, board-level SDRAM solution for personal computer and industrial platforms. Its 128 Mbit capacity, 2M×4-bank organization and support for common SDRAM modes (auto-refresh, self-refresh, burst access) streamline integration with standard memory controllers.
Backed by Winbond Electronics' device documentation, this part is appropriate for teams requiring verifiable timing, electrical and package data for system-level design, qualification and production in environments that demand extended temperature operation.
If you would like a formal quote or additional purchasing information, request a quote or contact sales for further assistance.