W9812G6KB-6
| Part Description |
IC DRAM 128MBIT LVTTL 54TFBGA |
|---|---|
| Quantity | 450 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | LVTTL | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of W9812G6KB-6 – IC DRAM 128 Mbit LVTTL 54-TFBGA
The W9812G6KB-6 is a high-speed synchronous DRAM (SDRAM) device organized as 2M × 4 banks × 16 bits, providing a total density of 128 Mbit. It implements a burst-oriented architecture with LVTTL I/O and is supplied in a 54-TFBGA (8×8) package.
Designed for systems requiring synchronous DRAM memory with defined timing and control features, this device operates up to 166 MHz with an access time of 5 ns and a supply range of 3.0 V to 3.6 V, supporting standard SDRAM command sequences including self-refresh and power-down modes.
Key Features
- Core / Memory Organization Organized as 2M × 4 banks × 16 bits (equivalent to 8M × 16); total memory size 128 Mbit.
- Performance Clock frequency up to 166 MHz with an access time of 5 ns; supports CAS latency and burst read/write operation.
- Interface LVTTL I/O signaling for memory interface compatibility with LVTTL-based systems.
- Power Supply voltage range from 3.0 V to 3.6 V.
- Operating Modes Supports standard SDRAM commands and modes including burst lengths (1, 2, 4, 8 or full page), auto-precharge, self-refresh, power-down and no-operation commands as described in the device functional description.
- Package & Mounting 54-TFBGA (8×8) package for BGA surface-mount assembly.
- Operating Temperature Commercial temperature range: 0°C to 70°C (TC grade).
- Timing & Control Detailed timing waveforms and operational examples (burst read/write, interleaved and page modes, refresh cycles) are specified in the device documentation for system integration and timing verification.
Typical Applications
- Embedded Systems Use as a synchronous DRAM working memory in embedded platforms that require 128 Mbit density and LVTTL interface.
- Consumer Electronics Suitable for designs needing burst-oriented SDRAM buffering and predictable timing at up to 166 MHz clock rates.
- Networking and Communications Applicable where burst read/write performance and self-refresh/power-down modes are required for transient or sustained data buffering.
Unique Advantages
- Deterministic burst performance: The device supports burst lengths of 1, 2, 4, 8 or full-page enabling predictable sequential access patterns.
- Well-documented timing: Comprehensive timing waveforms and operation examples in the datasheet simplify system timing verification and integration.
- Compact BGA footprint: 54-TFBGA (8×8) package provides a small, surface-mount solution for space-constrained PCBs.
- Standard LVTTL interface: LVTTL signaling facilitates integration with LVTTL-compatible memory controllers and logic.
- Low-voltage operation: 3.0 V to 3.6 V supply range supports common 3.3 V system rails.
Why Choose W9812G6KB-6?
The W9812G6KB-6 offers a straightforward SDRAM solution with explicit organization of 2M × 4 banks × 16 bits (128 Mbit), defined timing characteristics, and standard LVTTL interface. Its documented operating modes—burst access, auto-precharge, self-refresh and power-down—provide designers with the control needed for deterministic memory behavior in synchronous systems.
This device is suitable for designers and teams who require a compact 54-TFBGA packaged SDRAM with clear timing documentation and a commercial temperature rating of 0°C to 70°C. The available electrical and timing specifications support accurate system-level integration and validation.
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