W9812G6IH-6

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 109 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9812G6IH-6 – IC DRAM 128MBIT PAR 54TSOP II

The W9812G6IH-6 is a high-speed synchronous DRAM (SDRAM) device organized as 8M × 16 (2M × 4 banks × 16 bits) providing 128 Mbit of volatile memory with a parallel interface. This device implements SDRAM command and timing features and is offered in a 54‑lead TSOP II package (0.400", 10.16 mm width).

Designed for systems that require a 16-bit parallel SDRAM solution, the W9812G6IH-6 operates at a clock frequency of 166 MHz (‑6 speed grade/CL3) with a 3.0 V to 3.6 V supply range and an ambient operating temperature of 0 °C to 70 °C.

Key Features

  • Core Architecture  Organized as 2M × 4 banks × 16 bits (8M × 16 total), providing 128 Mbit of volatile storage for parallel-access systems.
  • SDRAM Technology  Synchronous DRAM with standard SDRAM command set including bank activate, read/write, auto-precharge, self-refresh and power-down modes.
  • Performance  Rated for a 166 MHz clock frequency (‑6 speed grade, CAS Latency 3) with a typical access time of 5 ns.
  • Voltage and Power  Operates from 3.0 V to 3.6 V supply, supporting standard 3 V SDRAM systems.
  • Package  54‑lead TSOP II (0.400", 10.16 mm width) package for compact, board-level integration.
  • Operating Range  Ambient operating temperature specified from 0 °C to 70 °C (TA).

Typical Applications

  • Parallel SDRAM system memory  For designs that require a 16-bit parallel SDRAM device providing 128 Mbit of volatile storage.
  • PCB designs with TSOP II footprint  Compact 54‑lead TSOP (0.400") package for board-level memory integration where that package is required.
  • 3.0 V memory subsystems  Use in systems designed around a 3.0 V to 3.6 V memory power domain and commercial ambient temperatures.

Unique Advantages

  • Clear, documented speed grade  The ‑6 speed grade provides a 166 MHz/CL3 operating point explicitly specified in the datasheet, enabling predictable timing integration.
  • Standard SDRAM feature set  Supports common SDRAM commands and modes (burst read/write, auto-precharge, self-refresh, power-down), simplifying memory controller design.
  • Compact TSOP II package  54‑lead TSOP II (0.400", 10.16 mm) allows dense placement and compatibility with existing TSOP footprint designs.
  • Wide supply voltage tolerance  Operational range from 3.0 V to 3.6 V accommodates typical 3 V memory rails.
  • Deterministic timing  Specified access time (5 ns) and detailed timing diagrams in the datasheet support accurate system timing analysis.

Why Choose W9812G6IH-6?

The W9812G6IH-6 offers a documented SDRAM solution for designs requiring 128 Mbit of parallel volatile storage with a 16-bit data interface. Its defined 166 MHz (‑6) speed grade, 5 ns access time specification, and standard SDRAM command set make it suitable for engineers implementing predictable memory timing in commercial-temperature systems.

This device is appropriate for projects that need a compact TSOP II package and standard 3.0 V supply compatibility, providing clear electrical and timing specifications for system integration and verification.

If you would like pricing, lead-time information, or a formal quote for the W9812G6IH-6, submit a request or inquiry and our team will respond with the details you need.

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