W9812G2KB-6I

The W9812G2KB-6I from Winbond Electronics is a 128 Mbit synchronous DRAM (SDRAM) organized as 1M × 4 banks × 32 bits. It is a high-speed, burst-oriented parallel DRAM device designed for systems requiring a parallel memory interface and up to 166 MHz operation.

This part is offered in the industrial -6I grade and is specified for operation from -40°C to 85°C, with a supply voltage range of 3.0 V to 3.6 V. Typical use cases include personal computer and industrial systems where a parallel SDRAM with programmable burst operation and compact BGA packaging is required.

Key Features

• Architecture  Organized as 1M words × 4 banks × 32 bits (4M × 32 memory organization), enabling parallel 32-bit data transfers.
• Performance  Supports a clock frequency up to 166 MHz and delivers a data bandwidth up to 166M words per second; access time listed as 5 ns.
• Burst-oriented operation  Supports burst access modes with selectable burst lengths (1, 2, 4, 8 or full page) and standard SDRAM command set including auto-precharge, self-refresh and power-down.
• Industrial temperature grade  -6I grade specified for operating temperature range of -40°C to 85°C (TA).
• Voltage and power  Operates from 3.0 V to 3.6 V supply voltage.
• Package  90-TFBGA (8 × 13) compact BGA package for space-constrained board designs.
• Interface  Parallel memory interface (SDRAM) with standard SDRAM control and timing behaviors (CAS latency support as per 166 MHz/CL3 specification).

Typical Applications

• Personal computer memory subsystems  Complies with personal computer industrial standard timing (166 MHz/CL3) suitable for PC module designs requiring parallel SDRAM.
• Industrial equipment  The -6I industrial grade and -40°C to 85°C operating range make the device appropriate for industrial systems with extended temperature requirements.
• Parallel-interface designs  Use in systems that require a 32-bit parallel SDRAM interface and burst-oriented data transfers.

Unique Advantages

• High sustained bandwidth: Up to 166M words per second operation provides predictable high-speed data transfer for burst-oriented accesses.
• Flexible burst modes: Configurable burst lengths (1, 2, 4, 8 or full page) and standard SDRAM commands support a range of memory access patterns.
• Industrial temperature support: The -6I grade is rated for -40°C to 85°C, addressing thermal requirements for industrial deployments.
• Compact BGA footprint: 90-TFBGA (8×13) packaging reduces board area while supporting high pin density for parallel data and control signals.
• Standard SDRAM compatibility: Designed to operate with common SDRAM timing and control conventions, including CAS latency operation at the specified clock rate.
• Wide supply tolerance: 3.0 V to 3.6 V supply range provides headroom for designs operating near standard 3.3 V systems.

Why Choose W9812G2KB-6I?

The W9812G2KB-6I delivers a straightforward, high-speed parallel SDRAM solution with a 128 Mbit density and 1M × 4 banks × 32-bit organization. Its support for burst-oriented transfers, standard SDRAM command set, and up-to-166 MHz operation make it suitable for designs that require deterministic, parallel memory performance.

This industrial-grade part is targeted at designers who need reliable operation across -40°C to 85°C, a compact 90-TFBGA package, and compatibility with parallel SDRAM interfaces and timing (including 166 MHz/CL3 operation). It is a practical choice for systems where proven SDRAM behavior, temperature range, and BGA packaging are primary selection criteria.

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