W9825G2JB-6 TR

The W9825G2JB-6 TR is a 256 Mbit synchronous DRAM (SDRAM) device organized as 16M × 16 with a parallel memory interface. It operates with a clock frequency up to 166 MHz and is optimized for systems that require volatile high-density memory in a compact 90‑TFBGA (8×13) package.

This SDRAM is suited for designs where predictable access timing, moderate operating temperature range (0°C to 70°C), and a 3.0 V to 3.6 V supply are required. The device includes documented timing and command behavior appropriate for burst-oriented memory access patterns.

Key Features

• Memory Type: Volatile SDRAM — Standard synchronous DRAM format for burst-oriented access.
• Density & Organization: 256 Mbit capacity organized as 16M × 16, providing a wide 16‑bit data bus for parallel system interfaces.
• Performance: 166 MHz maximum clock frequency with a 5 ns access time specification for responsive read/write operations.
• Voltage: 3.0 V to 3.6 V supply range compatible with common 3.3 V system rails.
• Package: 90‑TFBGA (8×13) supplier device package — compact ball-grid array footprint for high-density board designs.
• Operating Range: 0°C to 70°C ambient operating temperature (TA) for standard commercial applications.
• Interface & Mode Support: Parallel memory interface with documented SDRAM command set and burst modes as detailed in manufacturer documentation.

Typical Applications

• Embedded Systems — Provides 256 Mbit of volatile system memory for firmware, buffering, or working RAM in compact embedded platforms.
• Consumer Electronics — Suited for devices requiring moderate-speed parallel SDRAM in a small BGA package and standard commercial temperature range.
• Networking & Communications Modules — Can be used for packet buffering or temporary data storage where a 16‑bit parallel interface and 166 MHz clocking are appropriate.

Unique Advantages

• High-density, compact footprint: 256 Mbit capacity in a 90‑TFBGA (8×13) package reduces board area while delivering substantial memory capacity.
• Parallel 16‑bit data path: Wide data bus organization (16M × 16) enables straightforward integration into parallel memory architectures.
• Documented SDRAM behavior: Manufacturer datasheet provides detailed command timing, burst modes, and operating examples to aid design verification.
• Standard supply compatibility: 3.0 V to 3.6 V supply range aligns with common 3.3 V system rails for simplified power design.
• Performance for burst access: 166 MHz clocking and 5 ns access time support burst-oriented memory transactions with predictable timing.

Why Choose IC DRAM 256MBIT PAR 90TFBGA?

The W9825G2JB-6 TR positions itself as a straightforward, high-density SDRAM option for designs that require a 16‑bit parallel interface, documented synchronous command and timing behavior, and a compact BGA package. Its 256 Mbit capacity, 166 MHz clock rating, and 3.0 V–3.6 V supply make it suitable for a range of commercial applications where reliable volatile storage and burst access are needed.

With manufacturer-provided datasheet details covering command timing, operation modes, and package specifications, the device is well suited for engineers seeking a verifiable SDRAM building block for mid-density memory requirements in consumer and embedded product designs.

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