W9825G2JB-6I

The W9825G2JB-6I is a 256 Mbit synchronous DRAM (SDRAM) device with a parallel memory interface and a 16M × 16 memory organization. It is designed for high-speed burst-oriented memory access and supports operation up to a 166 MHz clock frequency with a 5 ns access time.

This device is specified to operate over a wide temperature range (‑40°C to 85°C) and is supplied in a compact 90‑TFBGA (8×13) package with a 3.0 V to 3.6 V supply range, making it suitable for designs that require reliable SDRAM capacity and predictable timing characteristics in compact form factors.

Key Features

• Core / Memory Architecture 256 Mbit SDRAM with a 16M × 16 organization for parallel data paths and banked access.
• Technology & Interface Synchronous DRAM (SDRAM) with a parallel memory interface and burst-oriented access.
• Performance Supports a clock frequency up to 166 MHz and a typical access time of 5 ns.
• Voltage Supply Operates from 3.0 V to 3.6 V.
• Operating Temperature Specified for operation from -40°C to 85°C (TA).
• Package 90-TFBGA (8×13) ball array package for compact board-level integration.
• Burst Operation Burst-oriented read/write access modes as described in device functional timing.
• Regulatory Note RoHS status: not specified in the product data.

Typical Applications

• Embedded systems — Provides parallel SDRAM capacity and deterministic timing for embedded designs that require 256 Mbit memory and 166 MHz operation.
• Industrial control — Suitable for control and automation equipment needing memory that supports -40°C to 85°C operating environments.
• Communications modules — Acts as working memory or buffering in network and communications hardware where burst-oriented SDRAM is required.

Unique Advantages

• Predictable timing performance: 5 ns access time and up to 166 MHz clock frequency enable consistent, high-speed burst transfers.
• Wide operating temperature: Rated from -40°C to 85°C to support designs deployed in extended temperature environments.
• Compact board footprint: 90‑TFBGA (8×13) package reduces PCB area for space-constrained applications.
• Standard SDRAM interface: Parallel SDRAM architecture and burst access simplify integration with controllers that use standard SDRAM timing.
• Flexible supply range: 3.0 V to 3.6 V operation supports common 3.3 V systems and tolerance for supply variation.

Why Choose IC DRAM 256MBIT PAR 90TFBGA?

The W9825G2JB-6I combines a 256 Mbit SDRAM architecture with high-speed synchronous operation and burst-oriented access to deliver predictable memory performance in a compact 90‑TFBGA package. With support for up to 166 MHz clocking, a 5 ns access time, and a wide operating temperature range, it is well suited to designs that require reliable parallel SDRAM capacity and stable timing across industrial temperature conditions.

Engineers specifying the W9825G2JB-6I gain a straightforward SDRAM option with clear electrical and timing characteristics (3.0–3.6 V supply, 16M × 16 organization) that simplify integration into embedded, industrial, and communications platforms where space and thermal performance are considerations.

Request a quote or submit a product inquiry for the W9825G2JB-6I to obtain pricing, availability, and technical support information.