W9825G2JB-6

IC DRAM 256MBIT PAR 90TFBGA
Part Description

IC DRAM 256MBIT PAR 90TFBGA

Quantity 677 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9825G2JB-6 – IC DRAM 256MBIT PAR 90TFBGA

The W9825G2JB-6 is a 256 Mbit volatile SDRAM device with a parallel memory interface, organized as 16M × 16. It implements a banked SDRAM architecture (4M × 4 banks × 16 bits) and supports burst-oriented access for efficient sequential data transfers.

With a 166 MHz clock capability, 5 ns access time, and a 90‑TFBGA (8×13) package, this device is suited for designs that require compact, high-speed parallel DRAM memory operating at standard 3.0–3.6 V supply levels and commercial temperature range.

Key Features

  • Memory Architecture  Organized as 16M × 16 (implemented as 4M × 4 banks × 16 bits) to deliver 256 Mbit total capacity and banked access for burst transfers.
  • SDRAM Technology  Synchronous DRAM with burst-oriented access modes and standard SDRAM command support including bank activate, read/write, auto-precharge, self-refresh and power-down sequences.
  • Performance  Supports a clock frequency up to 166 MHz with a typical access time of 5 ns for fast read/write cycles.
  • Interface  Parallel memory interface designed for direct system integration with standard SDRAM control signals and burst operation.
  • Power  Nominal voltage supply range of 3.0 V to 3.6 V suitable for standard 3.3 V systems.
  • Package & Thermal  Supplied in a 90‑TFBGA (8×13) package; specified operating ambient temperature range 0°C to 70°C (TA).

Typical Applications

  • Embedded systems  Board‑level parallel DRAM memory for systems requiring compact SDRAM capacity and burst access.
  • Video and graphics buffering  Parallel SDRAM burst transfers and banked architecture support sequential data streaming and frame buffering.
  • Memory expansion modules  Dense 256 Mbit capacity in a 90‑TFBGA package for module or board integration where a parallel SDRAM interface is required.

Unique Advantages

  • Banked SDRAM organization  4M × 4 banks × 16 bits implementation enables efficient burst operations across banks for improved throughput on sequential accesses.
  • High-frequency operation  166 MHz clock capability combined with a 5 ns access time supports fast system memory cycles.
  • Standard parallel interface  Parallel SDRAM signaling simplifies integration into designs that use conventional SDRAM controllers and command sets.
  • Compact, assembly-friendly package  90‑TFBGA (8×13) package delivers a small footprint for high-density board layouts.
  • Wide supply tolerance  3.0–3.6 V supply range accommodates standard 3.3 V system rails.

Why Choose W9825G2JB-6?

The W9825G2JB-6 provides a straightforward, high-speed parallel SDRAM option with a 256 Mbit capacity, banked architecture and burst-oriented operation. Its 166 MHz capability, 5 ns access time and standard SDRAM command support make it suitable for designs that require compact, fast volatile memory in a 90‑TFBGA package.

This device is appropriate for engineers and procurement teams specifying board-level parallel DRAM where predictable electrical characteristics (3.0–3.6 V supply, 0°C–70°C TA) and established SDRAM operation are required.

Request a quote or submit a parts inquiry for pricing, availability and lead‑time information for the W9825G2JB-6.

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