W9812G6KH-6 TR

IC DRAM 128MBIT LVTTL 54TSOP II
Part Description

IC DRAM 128MBIT LVTTL 54TSOP II

Quantity 641 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9812G6KH-6 TR – IC DRAM 128MBIT LVTTL 54TSOP II

The W9812G6KH-6 TR is a 128 Mbit volatile SDRAM device organized as 8M × 16 with an LVTTL memory interface. It is a synchronous DRAM offering a 166 MHz clock frequency and 5 ns access time for board-level memory implementations that require fast, synchronous data transfers.

This device is supplied in a 54-TSOP II package (0.400", 10.16 mm width) and operates from a 3.0 V to 3.6 V supply with an ambient operating temperature range of 0 °C to 70 °C.

Key Features

  • Core / Memory 128 Mbit SDRAM organized as 8M × 16; volatile memory suitable for synchronous DRAM applications.
  • Performance 166 MHz clock frequency with 5 ns access time to support high-speed read/write cycles.
  • Interface LVTTL memory interface for logic-level compatibility on suitable host designs.
  • Power Operates from a 3.0 V to 3.6 V supply range to match common 3 V system rails.
  • Package 54-TSOP II (0.400", 10.16 mm width) surface-mount package for compact board-level integration.
  • Temperature Range Specified operating ambient temperature: 0 °C to 70 °C (TA).

Typical Applications

  • Embedded and board-level systems — Provides 128 Mbit SDRAM capacity and LVTTL interface for embedded designs requiring synchronous DRAM memory.
  • Memory expansion modules — Suitable for board-mounted DRAM implementations where a 54-TSOP II package is required.
  • PC-oriented SDRAM designs — Matches SDRAM speed grades referenced for personal computer standards with defined clock and timing characteristics in the datasheet.

Unique Advantages

  • Defined high-speed timing: 166 MHz clock frequency and 5 ns access time support fast synchronous memory operations.
  • Compact surface-mount package: 54-TSOP II footprint enables dense board-level placement and standard assembly processes.
  • Standard LVTTL interface: Simplifies signaling integration with LVTTL-compatible host logic.
  • Flexible supply range: 3.0 V to 3.6 V support allows use with common 3 V system rails.
  • Clear operating window: Specified ambient temperature range of 0 °C to 70 °C for commercial-temperature deployments.

Why Choose W9812G6KH-6 TR?

The W9812G6KH-6 TR delivers a straightforward SDRAM option with defined timing (166 MHz / 5 ns), a 128 Mbit density, and an LVTTL interface in a compact 54-TSOP II package. Its electrical and package specifications make it appropriate for designs that require synchronous DRAM memory with clear supply and temperature requirements.

This device is suited to engineers and procurement teams building board-level memory solutions that need verifiable timing, a common 3.0–3.6 V supply range, and a surface-mount TSOP footprint for integration into commercial electronic products.

Request a quote or submit a technical inquiry for pricing, availability, and lead-time information for the W9812G6KH-6 TR.

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