W9812G6KH-5I TR

The W9812G6KH-5I TR is a high-speed synchronous dynamic RAM (SDRAM) device from Winbond Electronics, organized as 2M × 4 banks × 16 bits (total 128 Mbit). The -5I speed grade supports 200 MHz operation with CAS‑latency 3 and an industrial operating temperature range of -40°C to 85°C.

Designed for applications that require a compact 54‑TSOP II package with an LVTTL memory interface, this SDRAM provides burst read/write capability, self‑refresh and power‑down modes, and operates from a 3.0 V to 3.6 V supply.

Key Features

• Memory Core  Organized as 2M × 4 banks × 16 bits (8M × 16 total), delivering 128 Mbit of SDRAM storage for high‑speed temporary data storage.
• Performance  Supports up to 200 MHz clock frequency and is offered in the -5I grade compliant to the 200 MHz / CL3 specification; typical access time listed as 4.5 ns.
• SDRAM Command Set  Supports standard SDRAM operations including bank activate, burst read/write, auto‑precharge, precharge, auto‑refresh and self‑refresh, plus power‑down and no‑operation commands as described in the datasheet.
• Interface  LVTTL memory interface for compatible control signaling.
• Power  Voltage supply range of 3.0 V to 3.6 V to support common 3 V SDRAM system rails.
• Package  54‑TSOP II (0.400", 10.16 mm width) surface mount package suitable for compact board layouts.
• Operating Temperature  -40°C to 85°C for the -5I industrial grade, enabling deployment in temperature‑sensitive environments.

Typical Applications

• Personal computer memory subsystems  Use where compliance with personal computer industrial standards at 200 MHz / CL3 is required.
• Industrial embedded systems  Systems requiring operation across -40°C to 85°C that need a 128 Mbit SDRAM in a compact TSOP package.
• High‑speed buffering and temporary storage  Designs that require synchronous burst read/write capability and standard SDRAM control for transient data handling.

Unique Advantages

• Industrial temperature support: The -5I grade supports -40°C to 85°C, enabling reliable operation in harsh thermal environments.
• Validated 200 MHz operation: Specified for 200 MHz / CL3 operation in the -5I speed grade for systems targeting that performance level.
• Compact package: 54‑TSOP II (0.400", 10.16 mm) strikes a balance between board space and ease of assembly for dense PCBs.
• Standard SDRAM feature set: Built‑in support for burst operations, auto‑refresh, self‑refresh and power‑down modes simplifies memory controller implementation.
• 3.0 V supply compatibility: Operates from 3.0 V to 3.6 V rails common in SDRAM systems, easing power‑rail integration.

Why Choose IC DRAM 128MBIT LVTTL 54TSOP II?

The W9812G6KH-5I TR positions itself as a practical SDRAM choice where a 128 Mbit capacity, 200 MHz performance and industrial temperature range are required in a compact TSOP package. Its standard SDRAM feature set and LVTTL interface make it suitable for designs that need predictable burst behavior, self‑refresh and power‑down capabilities.

This device is appropriate for engineers and procurement teams specifying memory for PC‑standard 200 MHz designs or industrial embedded systems that demand a combination of performance, compact packaging and extended temperature operation.

Request a quote or contact sales to discuss availability, lead times and pricing for the W9812G6KH-5I TR.