W9825G2JB-6I TR

IC DRAM 256MBIT PAR 90TFBGA
Part Description

IC DRAM 256MBIT PAR 90TFBGA

Quantity 666 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of W9825G2JB-6I TR – IC DRAM 256MBIT PAR 90TFBGA

The W9825G2JB-6I TR is a 256 Mbit volatile SDRAM organized as 16M × 16 (equivalently 4M × 4 banks × 16 bits) with a parallel memory interface. It provides burst-oriented access and is offered in a 90-TFBGA (8×13) package for space-efficient board integration.

This device targets systems that require a parallel SDRAM solution with up to 166 MHz clock operation, a 5 ns access time, and industrial temperature operation from -40°C to 85°C (TA) for the -6I grade.

Key Features

  • Memory Type and Organization  256 Mbit SDRAM organized as 16M × 16 (4M × 4 banks × 16 bits) supporting burst-oriented accesses.
  • Performance  Operates up to 166 MHz clock frequency with a specified access time of 5 ns.
  • Interface  Parallel memory interface suitable for controllers expecting standard SDRAM signaling and burst modes.
  • Voltage  Single supply operation from 3.0 V to 3.6 V.
  • Temperature Range  Industrial-grade operating temperature: -40°C to 85°C (TA) for the -6I grade.
  • Package  90-TFBGA (8×13) package case for compact surface-mount implementation.
  • Functional Modes  Supports standard SDRAM command set including mode register programming, auto-refresh, self-refresh and power-down modes (per device datasheet).

Typical Applications

  • Embedded Systems  Use as external parallel SDRAM for embedded boards that require 256 Mbit memory capacity and burst access.
  • Buffered Subsystems  Suitable for designs needing a parallel SDRAM buffer with 166 MHz clock support and 5 ns access time.
  • Industrial Equipment  Applicable where industrial temperature range (-40°C to 85°C) operation is required for memory components.

Unique Advantages

  • Industrial Temperature Grade: The -6I grade supports -40°C to 85°C (TA), enabling deployment in temperature-challenging environments.
  • High Clock Bandwidth: Rated up to 166 MHz, providing higher data throughput for parallel SDRAM applications.
  • Fast Access Time: 5 ns access time helps reduce latency for time-sensitive read/write operations.
  • Compact BGA Package: 90-TFBGA (8×13) package reduces board footprint while providing robust soldered connections.
  • Standard Voltage Range: 3.0 V to 3.6 V supply compatibility simplifies integration with common 3.3 V system rails.
  • Burst-Oriented Operation: Native support for burst read/write modes as described in the device functional description improves sequential data transfer efficiency.

Why Choose W9825G2JB-6I TR?

The W9825G2JB-6I TR combines a 256 Mbit SDRAM organization, support for burst-oriented parallel access, and a compact 90-TFBGA footprint to deliver a practical memory option for systems requiring moderate capacity and high-rate parallel transfers. Its 166 MHz clock rating and 5 ns access time provide measurable bandwidth and responsiveness for embedded and industrial applications.

This industrial-grade device is suited to designs that require reliable operation across -40°C to 85°C and compatibility with 3.0–3.6 V systems, offering straightforward integration into existing parallel SDRAM controller architectures.

To request a quote or submit a request for pricing and availability, please contact sales or request a formal quote through your procurement channel.

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