W9864G6KH-5 TR
| Part Description |
IC DRAM 64MBIT PAR 54TSOP II |
|---|---|
| Quantity | 613 Available (as of May 4, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5 ns | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of W9864G6KH-5 TR – IC DRAM 64Mbit PAR 54TSOP II
The W9864G6KH-5 TR is a 64 Mbit volatile synchronous DRAM (SDRAM) organized as 1M × 4 banks × 16 bits with a parallel memory interface. It is a burst-oriented SDRAM device designed to deliver synchronous memory bandwidth up to the -5 speed grade specification.
Targeted at designs requiring parallel SDRAM storage, this device provides 64 Mbit capacity, support for burst read/write operations, and a 54-TSOP II package targeted for board-level integration where a compact TSOP footprint is required.
Key Features
- Memory Architecture Organized as 1M × 4 banks × 16 bits (4M × 16 logical organization) providing 64 Mbit total capacity for parallel SDRAM applications.
- High-Speed Operation -5 speed grade supports operation up to 200 MHz/CL3 and the device family is specified for burst-oriented accesses and mode-register programmable operation.
- Access Performance Access time specified at 5 ns for fast synchronous read/write cycles and support for burst lengths and CAS latency options as defined in the device functional description.
- Power and Voltage Standard supply range of 3.0 V to 3.6 V suitable for 3.3 V system rails; supports power-down and self-refresh modes for reduced power during idle periods (per functional description).
- Memory Commands & Modes Supports bank activate, burst read/write, auto-precharge, precharge, self-refresh, power-down, and mode register programming for flexible memory control and timing.
- Package & Mounting Available in a 54-TSOP II package (0.400" / 10.16 mm width) for surface-mount placement in space-constrained board designs.
- Operating Environment Rated for ambient operating temperature from 0°C to 70°C (TA) for standard commercial deployments.
Typical Applications
- Embedded system memory Used as parallel SDRAM for embedded platforms and board-level memory expansion where 64 Mbit volatile storage is required.
- Consumer and electronics designs Provides synchronous burst memory for designs requiring standard 3.3 V supply and compact TSOP footprint.
- Legacy parallel-memory designs Suitable for systems and development platforms that use parallel SDRAM interfaces and burst-oriented access patterns.
Unique Advantages
- Verified SDRAM architecture: 1M × 4 banks × 16 bits organization delivers straightforward mapping for parallel memory systems and predictable burst behavior.
- High-frequency capability: -5 grade operation up to 200 MHz/CL3 enables higher throughput for burst transfers compared to lower frequency grades within the same family.
- Flexible power modes: Built-in self-refresh and power-down commands reduce standby power and simplify low-power management in system designs.
- Compact surface-mount package: 54-TSOP II package (10.16 mm width) eases board layout in constrained spaces while maintaining traditional parallel SDRAM pinout.
- Standard supply compatibility: 3.0 V to 3.6 V supply range matches common 3.3 V systems for straightforward integration.
Why Choose W9864G6KH-5 TR?
The W9864G6KH-5 TR positions itself as a practical choice when a compact, parallel 64 Mbit SDRAM is required. With a 1M × 4 banks × 16-bit organization, support for burst-oriented access, and -5 grade operation up to 200 MHz/CL3, it delivers synchronous, low-latency memory suitable for designs that require predictable SDRAM timing and standard 3.3 V supply compatibility.
This device is appropriate for engineers specifying board-level SDRAM in a 54-TSOP II package and looking for standard SDRAM functionality including auto-precharge, self-refresh, power-down modes, and programmable mode registers for timing and burst configuration.
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