W9864G6KH-6I

The W9864G6KH-6I from Winbond Electronics is a 64 Mbit synchronous DRAM (SDRAM) device organized as 1M × 4 banks × 16 bits with a parallel memory interface. It implements burst-oriented SDRAM operation and is offered in a compact 54-lead TSOP II package for board-level memory integration.

Targeted for system designs that require documented SDRAM timing and predictable performance, this -6I speed grade supports up to 166 MHz operation (CAS latency 3) and is specified for an operating ambient range of -40°C to 85°C, making it suitable for industrial-temperature applications.

Key Features

• Core Architecture — Organized as 1M × 4 banks × 16 bits to provide a 4M × 16 memory organization for parallel access patterns.
• Memory Type — SDRAM (volatile DRAM) with burst-oriented access and programmable mode register for CAS latency and burst length configuration.
• Performance — -6I speed grade rated for up to 166 MHz operation with CAS latency 3; device documentation cites up to 200M words per second data bandwidth.
• Access Timing — Fast access characteristics with a 5 ns access time specification noted in device data.
• Voltage and Power — Single-supply operation from 3.0 V to 3.6 V to match standard 3 V SDRAM system rails.
• Package — 54-lead TSOP II (0.400", 10.16 mm width) in a compact footprint for high-density board layouts.
• Environmental / Temperature — Industrial-grade operating ambient range of -40°C to 85°C (TA) for temperature-sensitive designs.
• Interface — Parallel SDRAM interface with full documentation of command sequences, read/write modes, burst operations, refresh and power-down modes.

Typical Applications

• Industrial Control Systems — Industrial temperature rating (-40°C to 85°C) and robust SDRAM timing make the device suitable for control and automation memory expansion.
• Embedded Memory Subsystems — 64 Mbit capacity and parallel SDRAM interface for board-level buffering and program/data storage in embedded platforms.
• Board-Level Memory Upgrades — Compact 54-TSOP II package simplifies replacement or upgrade of legacy parallel SDRAM footprints on custom PCBs.

Unique Advantages

• Industrial Temperature Grade: The -6I variant is specified for -40°C to 85°C operation, addressing thermal requirements of harsh environments.
• Documented SDRAM Behavior: Comprehensive datasheet content covers initialization, mode register programming, bank activation, burst read/write, refresh and timing waveforms for deterministic system design.
• High Throughput Capability: Rated for up to 166 MHz operation with datasheet bandwidth guidance (up to 200M words/sec), supporting high-rate burst transfers.
• Standard 3.0–3.6 V Supply: Compatible with common 3 V SDRAM system rails for straightforward power integration.
• Compact TSOP II Footprint: 54‑lead, 0.400" (10.16 mm) wide TSOP II package minimizes board area while preserving accessible pinout for parallel memory interfaces.
• Parallel Interface: Parallel SDRAM signaling supports legacy and board-level designs that require conventional SDRAM command and timing control.

Why Choose W9864G6KH-6I?

The W9864G6KH-6I positions itself as a documented, industrial-temperature SDRAM solution for designs that require 64 Mbit of parallel DRAM with deterministic burst behavior and clear timing guidance. Its -6I speed grade, supported voltage range, and TSOP II package make it suitable for embedded and industrial board-level memory implementations where operating temperature and well-defined timing are priorities.

Backed by Winbond Electronics’ device documentation, the part provides designers with the command sequences, timing diagrams and operating modes needed to integrate SDRAM into systems with predictable performance and maintainable design margins.

For pricing, lead-time or to request a formal quote, contact sales or submit a parts inquiry referencing part number W9864G6KH-6I and your required quantity and delivery timeline.