W9864G6KH-6 TR
| Part Description |
IC DRAM 64MBIT PAR 54TSOP II |
|---|---|
| Quantity | 682 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of W9864G6KH-6 TR – IC DRAM 64MBIT PAR 54TSOP II
The W9864G6KH-6 TR is a high-speed synchronous DRAM (SDRAM) device providing 64 Mbit of volatile memory in a 4M × 16 organization. It implements a parallel memory interface in a 54-TSOP II package and is offered in the -6 speed grade rated for operation up to 166 MHz/CL3.
Key technical characteristics include a 3.0 V to 3.6 V supply range, a 0°C to 70°C ambient operating range, and a 5 ns access time, making the device suitable for applications that require parallel SDRAM storage with defined timing and voltage requirements.
Key Features
- Memory Architecture 64 Mbit SDRAM organized as 1M × 4 banks × 16 bits (reported as 4M × 16), supporting burst-oriented access and banked operation as described in the device documentation.
- Speed Grade & Clock -6 speed grade rated to run up to 166 MHz with CAS latency settings described in the datasheet (e.g., CL3).
- Timing Fast access characteristics with a specified access time of 5 ns and detailed AC timing and command sequences available in the device documentation.
- Voltage & Power Operates from a 3.0 V to 3.6 V supply range consistent with standard SDRAM voltage levels.
- Interface Parallel SDRAM interface with standard SDRAM command set support (read, write, auto-precharge, refresh, self-refresh, power-down, and others described in the datasheet).
- Package 54-TSOP II package (0.400" / 10.16 mm width) suitable for surface-mount assembly.
- Operating Temperature Specified ambient range of 0°C to 70°C (TA) for the -6 grade part.
- Documentation Detailed functional description, command timing, and package specifications are provided in the device datasheet, including timing examples for burst reads/writes, refresh and power modes.
Typical Applications
- Parallel memory subsystems Use where a 64 Mbit parallel SDRAM (4M × 16) is required with defined timing and banked burst operation.
- Board-level DRAM replacement or upgrades Drop-in candidate for designs specifying a 54-TSOP II packaged SDRAM device with 3.0–3.6 V supply requirements.
- Systems requiring defined thermal and voltage envelopes Suitable for designs operating within 0°C to 70°C and 3.0 V–3.6 V supply constraints.
Unique Advantages
- Banked memory organization: 1M × 4 banks × 16 bits arrangement enables burst-oriented accesses and interleaved bank operations as documented, improving sustained transfer patterns where supported by system logic.
- Defined speed grade: The -6 grade supports operation up to 166 MHz/CL3, providing a clear performance target for timing-sensitive designs.
- Comprehensive timing documentation: The datasheet includes extensive timing waveforms, command sequences, and operating timing examples (burst lengths, CAS latency, auto-precharge, refresh cycles) to aid system integration and validation.
- Standard supply range: Operates on a 3.0 V to 3.6 V supply, aligning with common SDRAM power rails for straightforward power design.
- Compact surface-mount package: 54-TSOP II package profile supports space-constrained PCB layouts while retaining parallel SDRAM connectivity.
Why Choose IC DRAM 64MBIT PAR 54TSOP II?
The W9864G6KH-6 TR combines a clear, banked SDRAM architecture (1M × 4 banks × 16 bits) with a defined -6 speed grade (up to 166 MHz) and documented timing examples to simplify integration into systems that require parallel SDRAM memory. Its 54-TSOP II package and 3.0–3.6 V supply make it compatible with common board-level memory implementations.
This device is appropriate for designers and procurement teams needing a documented, mid-capacity SDRAM with explicit electrical and timing specifications, enabling predictable system behavior and aiding validation against timing and thermal constraints.
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