W9864G6KH-6 TR

IC DRAM 64MBIT PAR 54TSOP II
Part Description

IC DRAM 64MBIT PAR 54TSOP II

Quantity 682 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9864G6KH-6 TR – IC DRAM 64MBIT PAR 54TSOP II

The W9864G6KH-6 TR is a high-speed synchronous DRAM (SDRAM) device providing 64 Mbit of volatile memory in a 4M × 16 organization. It implements a parallel memory interface in a 54-TSOP II package and is offered in the -6 speed grade rated for operation up to 166 MHz/CL3.

Key technical characteristics include a 3.0 V to 3.6 V supply range, a 0°C to 70°C ambient operating range, and a 5 ns access time, making the device suitable for applications that require parallel SDRAM storage with defined timing and voltage requirements.

Key Features

  • Memory Architecture 64 Mbit SDRAM organized as 1M × 4 banks × 16 bits (reported as 4M × 16), supporting burst-oriented access and banked operation as described in the device documentation.
  • Speed Grade & Clock -6 speed grade rated to run up to 166 MHz with CAS latency settings described in the datasheet (e.g., CL3).
  • Timing Fast access characteristics with a specified access time of 5 ns and detailed AC timing and command sequences available in the device documentation.
  • Voltage & Power Operates from a 3.0 V to 3.6 V supply range consistent with standard SDRAM voltage levels.
  • Interface Parallel SDRAM interface with standard SDRAM command set support (read, write, auto-precharge, refresh, self-refresh, power-down, and others described in the datasheet).
  • Package 54-TSOP II package (0.400" / 10.16 mm width) suitable for surface-mount assembly.
  • Operating Temperature Specified ambient range of 0°C to 70°C (TA) for the -6 grade part.
  • Documentation Detailed functional description, command timing, and package specifications are provided in the device datasheet, including timing examples for burst reads/writes, refresh and power modes.

Typical Applications

  • Parallel memory subsystems Use where a 64 Mbit parallel SDRAM (4M × 16) is required with defined timing and banked burst operation.
  • Board-level DRAM replacement or upgrades Drop-in candidate for designs specifying a 54-TSOP II packaged SDRAM device with 3.0–3.6 V supply requirements.
  • Systems requiring defined thermal and voltage envelopes Suitable for designs operating within 0°C to 70°C and 3.0 V–3.6 V supply constraints.

Unique Advantages

  • Banked memory organization: 1M × 4 banks × 16 bits arrangement enables burst-oriented accesses and interleaved bank operations as documented, improving sustained transfer patterns where supported by system logic.
  • Defined speed grade: The -6 grade supports operation up to 166 MHz/CL3, providing a clear performance target for timing-sensitive designs.
  • Comprehensive timing documentation: The datasheet includes extensive timing waveforms, command sequences, and operating timing examples (burst lengths, CAS latency, auto-precharge, refresh cycles) to aid system integration and validation.
  • Standard supply range: Operates on a 3.0 V to 3.6 V supply, aligning with common SDRAM power rails for straightforward power design.
  • Compact surface-mount package: 54-TSOP II package profile supports space-constrained PCB layouts while retaining parallel SDRAM connectivity.

Why Choose IC DRAM 64MBIT PAR 54TSOP II?

The W9864G6KH-6 TR combines a clear, banked SDRAM architecture (1M × 4 banks × 16 bits) with a defined -6 speed grade (up to 166 MHz) and documented timing examples to simplify integration into systems that require parallel SDRAM memory. Its 54-TSOP II package and 3.0–3.6 V supply make it compatible with common board-level memory implementations.

This device is appropriate for designers and procurement teams needing a documented, mid-capacity SDRAM with explicit electrical and timing specifications, enabling predictable system behavior and aiding validation against timing and thermal constraints.

Request a quote or submit a sales inquiry to obtain pricing, lead-time, and availability for the W9864G6KH-6 TR. Provide part number and required quantity for the fastest response.

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