MCIMX280CVM4B

IC MPU I.MX28 454MHZ 289MAPBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX28 1 Core, 32-Bit 454MHz 289-MAPBGA (14x14)

Quantity 836 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 280
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPData; DCPCore ProcessorARM926EJ-SDevice Package289-MAPBGA (14x14)
Display & Interface ControllersKeypadECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case289-LFBGARAM ControllersLVDDR, LVDDR2, DDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Cryptography, Hardware ID
Speed454MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX280CVM4B – IC MPU I.MX28 454MHz 289-MAPBGA

The MCIMX280CVM4B is an applications microprocessor based on NXP's ARM926EJ-S core, running at up to 454 MHz. Optimized for embedded industrial and consumer markets, the device delivers a fast, power-efficient solution with integrated power management and on-chip SRAM for compact system designs.

Designed for a variety of embedded use cases, the i.MX28 family targets human‑machine interfaces, industrial control, handheld devices and energy/communications gateways, offering integrated connectivity and system-level features for reliable deployment in industrial environments.

Key Features

  • Core 
    ARM926EJ-S single 32‑bit core with operating frequency up to 454 MHz, providing deterministic processing for embedded applications.
  • Memory Support 
    Integrated 128‑KB on‑chip SRAM plus external memory controller support for LVDDR, LVDDR2 and DDR2; supports SLC and MLC NAND Flash connections for flexible storage options.
  • Power Management 
    Integrated power management unit with a triple‑output DC‑DC switching converter and multiple linear regulators; includes power sequencing and battery charging capability (Li‑Ion) to simplify power subsystem design.
  • Connectivity 
    Built‑in 10/100 Mbps Ethernet port and two USB 2.0 controllers with PHY to enable wired network and peripheral connectivity.
  • Security 
    On‑chip security features including boot security, cryptography and a hardware ID to support secure device identity and trusted boot flows.
  • Peripherals & Interfaces 
    Includes keypad display interface controller and standard serial interfaces such as I²C; Data Co‑Processor (DCP) available for accelerated data operations.
  • Package & Mounting 
    289‑ball MAPBGA package (14 × 14 mm, 0.8 mm pitch), surface‑mount construction suitable for compact board layouts.
  • Industrial Qualification & Temperature 
    Qualified for industrial use with specified operating temperature range of −40 °C to 85 °C and RoHS compliance for regulatory conformity.

Typical Applications

  • Human‑Machine Interfaces (HMI) 
    Industrial and consumer HMI panels leveraging the processor's efficient core and peripheral set for user interfaces and control panels.
  • Industrial Control & Automation 
    PLCs, I/O controllers and factory robotics displays that benefit from industrial qualification, integrated power sequencing and robust I/O connectivity.
  • Handheld Scanners & Printers 
    Portable devices that require compact packaging, integrated power management and flexible memory options for firmware and storage.
  • Smart Energy & Gateways 
    Energy meters and gateways using the device's Ethernet and security features for networked metering and secure communications.
  • Medical & Monitoring Devices 
    Patient monitoring and portable medical equipment where industrial temperature range and integrated system features support reliable operation.

Unique Advantages

  • Highly integrated power subsystem 
    On‑chip PMU with DC‑DC and linear regulators reduces external power components and simplifies power sequencing for the device and peripherals.
  • Reduced external memory requirements 
    128‑KB on‑chip SRAM enables smaller RTOS footprints and can reduce the need for external RAM in constrained designs.
  • Flexible memory interfacing 
    Support for LVDDR/LVDDR2/DDR2 and SLC/MLC NAND Flash allows designers to choose memory options that match capacity and cost targets.
  • Built‑in connectivity 
    Integrated Ethernet and dual USB 2.0 + PHY provide out‑of‑the‑box networking and peripheral connectivity for many embedded systems.
  • Industrial‑grade reliability 
    Industrial qualification and wide operating temperature range (−40 °C to 85 °C) support deployment in demanding environments.
  • Security primitives included 
    Boot security, cryptography and hardware ID support secure device identity and trusted boot mechanisms.

Why Choose MCIMX280CVM4B?

The MCIMX280CVM4B positions itself as a compact, power‑efficient embedded processor that combines an ARM926EJ‑S core with integrated power management, security and connectivity to address industrial and consumer embedded designs. Its support for flexible external memory, on‑chip SRAM and industrial temperature qualification make it suitable for space‑constrained systems that require dependable operation.

Backed by NXP Semiconductors' i.MX28 series engineering, this device is well suited for designers seeking a balance of integration, connectivity and system‑level features to streamline BOM, reduce board complexity and accelerate time to market.

Request a quote or submit an inquiry for pricing, lead time and availability for the MCIMX280CVM4B to evaluate it in your next embedded design.

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