 | | KMPC8379EVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 571 | |
 | | KMPC852TCVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 62 | |
 | | KMPC852TVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,394 | |
 | | KMPC8533EVTAQG | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 272 | |
 | | KMPC8560CVT667JB | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 598 | |
 | | KMPC8560PX833LC | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 769 | |
 | | KMPC8560VT833LB | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,326 | |
 | | KMPC8560VT833LC | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 916 | |
 | | KMPC860PCZQ66D4 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 523 | |
 | | KMPC860SRCVR50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 159 | |
 | | KMPC860TCVR50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,586 | |
 | | KMPC860TCZQ50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 323 | |
 | | KMPC860TVR80D4 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,327 | |
 | | KMPC862PVR100B | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,009 | |
 | | KMPC866PVR133A | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 894 | |
 | | KMPC866TVR133A | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 304 | |
 | | KMPC875CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,334 | |
 | | KMPC875VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 328 | |
 | | KMPC885CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 660 | |
 | | KMPC885CZP133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 108 | |