 | | MIMX8MN6CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 327 | |
| N/A | N/A | MIMX8MN6DUCJZAA | NXP Semiconductors | NANO SOLOLITE I.MX 8M LFBGA486 | Microprocessors | 486-LFBGA (14x14) | N/A | 0 °C – 95 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4, LPDDR4 USB: USB 2.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: ARM® Cortex®-M7 Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI | 1,117 | |
 | | MIMX8MN6DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 465 | |
| N/A | | MIMX8MN6DVTJZCA | NXP Semiconductors | IC MPU 1.5GHZ/750MHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 5 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 470 | |
| N/A | | MIMX8MN6DVTJZDA | NXP Semiconductors | IC MPU 1.5GHZ/750MHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 5 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 1,361 | |
 | | MIMX8MQ5CVAHZAA | NXP Semiconductors | IC MPU I.MX8MQ 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 194 | |
 | | MIMX8MQ5CVAHZAB | NXP Semiconductors | IC MPU I.MX8MQ 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 770 | |
 | | MIMX8MQ5DVAJZAA | NXP Semiconductors | IC MPU I.MX8MQ 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 150 | |
 | | MIMX8MQ5DVAJZAB | NXP Semiconductors | IC MPU I.MX8MQ 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,855 | |
 | | MIMX8MQ6CVAHZAB | NXP Semiconductors | IC MPU I.MX8MQ 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 810 | |
 | | MIMX8MQ6DVAJZAA | NXP Semiconductors | IC MPU I.MX8MQ 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 327 | |
 | | MIMX8MQ6DVAJZAB | NXP Semiconductors | IC MPU I.MX8MQ 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 415 | |
| N/A | | MIMX8QM5AVUFEAB | NXP Semiconductors | IC | Microprocessors | N/A | N/A | -40 °C – 125 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI | 414 | |
| N/A | | MIMX8QM5AVUFFAB | NXP Semiconductors | MPU I.MX8 QUAD MAX | Microprocessors | N/A | N/A | -40 °C – 125 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Graphics Acceleration: Yes | 1,596 | |
| N/A | | MIMX8QM6AVUFEAB | NXP Semiconductors | IC | Microprocessors | N/A | N/A | -40 °C – 125 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI | 933 | |
 | | MIMX8QM6AVUFFAB | NXP Semiconductors | IC MPU 266MHZ/1.2/1.6GHZ 1313BGA | Microprocessors | 1313-BGA (29x29) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Number of Cores/Bus Width: 2, 2, 4 Speed: 266MHz, 1.2GHz, 1.6GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: LPDDR4, DRAM Graphics Acceleration: Yes Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 1313-BFBGA Supplier Device Package: 1313-BGA (29×29) | 1,262 | |
| N/A | | MIMX8QM6AVUFFABR | NXP Semiconductors | I.MX 8QUADMAX | Microprocessors | 1313-BGA (29x29) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 1.6GHz, 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: Yes Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Mounting Type: Surface Mount Package / Case: 1313-BFBGA Supplier Device Package: 1313-BGA (29×29) | 263 | |
| N/A | N/A | MIMX8QM6CVUFFAB | NXP Semiconductors | MPU I.MX8 QUAD MAX | Microprocessors | N/A | N/A | -40 °C – 105 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI | 1,354 | |
| N/A | N/A | MIMX8QP5AVUFEAB | NXP Semiconductors | IC | Microprocessors | N/A | N/A | -40 °C – 125 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI | 953 | |
 | | MIMX8QP5AVUFFAB | NXP Semiconductors | IC MPU 266MHZ/1.2/1.6GHZ 1313BGA | Microprocessors | 1313-BGA (29x29) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Number of Cores/Bus Width: 1, 2, 4 Speed: 266MHz, 1.2GHz, 1.6GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: LPDDR4, DRAM Graphics Acceleration: Yes Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 1313-BFBGA Supplier Device Package: 1313-BGA (29×29) | 512 | |