Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MIMX8MN6CVTIZAAMIMX8MN6CVTIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
327
N/AN/AMIMX8MN6DUCJZAANXP SemiconductorsNANO SOLOLITE I.MX 8M LFBGA486Microprocessors486-LFBGA (14x14)N/A0 °C – 95 °C
Speed:
1.5 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
RAM Controllers:
DDR3L, DDR4, LPDDR4
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-M7
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Qualification:
Consumer
1,117
MIMX8MN6DVTJZAAMIMX8MN6DVTJZAANXP SemiconductorsIC MPU I.MX8MN 1.5GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
465
N/AMIMX8MN6DVTJZCANXP SemiconductorsIC MPU 1.5GHZ/750MHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
5 Core, 64-Bit
Speed:
1.5GHz, 750MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI, LCD
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
470
N/AMIMX8MN6DVTJZDANXP SemiconductorsIC MPU 1.5GHZ/750MHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
5 Core, 64-Bit
Speed:
1.5GHz, 750MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI, LCD
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
1,361
MIMX8MQ5CVAHZAAMIMX8MQ5CVAHZAANXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
194
MIMX8MQ5CVAHZABMIMX8MQ5CVAHZABNXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
770
MIMX8MQ5DVAJZAAMIMX8MQ5DVAJZAANXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
150
MIMX8MQ5DVAJZABMIMX8MQ5DVAJZABNXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
1,855
MIMX8MQ6CVAHZABMIMX8MQ6CVAHZABNXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
810
MIMX8MQ6DVAJZAAMIMX8MQ6DVAJZAANXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
327
MIMX8MQ6DVAJZABMIMX8MQ6DVAJZABNXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
415
N/AMIMX8QM5AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 125 °C
Speed:
1.3 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Ethernet:
1G, AVB
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Qualification:
Automotive
414
N/AMIMX8QM5AVUFFABNXP SemiconductorsMPU I.MX8 QUAD MAXMicroprocessorsN/AN/A-40 °C – 125 °C
Speed:
1.6 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Qualification:
Automotive
1,596
N/AMIMX8QM6AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 125 °C
Speed:
1.3 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Ethernet:
1G, AVB
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Qualification:
Automotive
933
MIMX8QM6AVUFFABMIMX8QM6AVUFFABNXP SemiconductorsIC MPU 266MHZ/1.2/1.6GHZ 1313BGAMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
2, 2, 4
Speed:
266MHz, 1.2GHz, 1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
LPDDR4, DRAM
Graphics Acceleration:
Yes
USB:
USB (3)
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
1,262
N/AMIMX8QM6AVUFFABRNXP SemiconductorsI.MX 8QUADMAXMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
8 Core, 64-Bit
Speed:
1.6GHz, 1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
1Gbps (2)
USB:
USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
263
N/AN/AMIMX8QM6CVUFFABNXP SemiconductorsMPU I.MX8 QUAD MAXMicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
1.3 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Ethernet:
1G, AVB
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Qualification:
Industrial
1,354
N/AN/AMIMX8QP5AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 125 °C
Speed:
1.3 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Ethernet:
1G, AVB
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Qualification:
Automotive
953
MIMX8QP5AVUFFABMIMX8QP5AVUFFABNXP SemiconductorsIC MPU 266MHZ/1.2/1.6GHZ 1313BGAMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
1, 2, 4
Speed:
266MHz, 1.2GHz, 1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
LPDDR4, DRAM
Graphics Acceleration:
Yes
USB:
USB (3)
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
512

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