Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MIMX8MM6CVTKZAAMIMX8MM6CVTKZAANXP SemiconductorsIC MPU I.MX8MM 1.6GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
1,866
N/AMIMX8MM6CVTKZAARNXP SemiconductorsI.MX 8M MINI QUADMicroprocessors486-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Ethernet:
GbE (1)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA
Supplier Device Package:
486-LFBGA (14×14)
574
MIMX8MM6DVTLZAAMIMX8MM6DVTLZAANXP SemiconductorsIC MPU I.MX8MM 1.8GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
556
MIMX8MM6DVTLZAARMIMX8MM6DVTLZAARNXP SemiconductorsIC MPU I.MX8MM 1.8GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA
Supplier Device Package:
486-LFBGA (14×14)
1,097
MIMX8MN1CVPIZAAMIMX8MN1CVPIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 306TFBGAMicroprocessors306-TFBGA (11x11)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
306-TFBGA
Supplier Device Package:
306-TFBGA (11×11)
21
MIMX8MN1CVTIZAAMIMX8MN1CVTIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
320
MIMX8MN1DVPIZAAMIMX8MN1DVPIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 306TFBGAMicroprocessors306-TFBGA (11x11)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
306-TFBGA
Supplier Device Package:
306-TFBGA (11×11)
457
MIMX8MN1DVTJZAAMIMX8MN1DVTJZAANXP SemiconductorsIC MPU I.MX8MN 1.5GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
874
N/AMIMX8MN2CVTIZAANXP SemiconductorsIC MPU 1.4GHZ/750MHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.4GHz, 750MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI, LCD
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA
Supplier Device Package:
486-LFBGA (14×14)
946
MIMX8MN2DVTJZAAMIMX8MN2DVTJZAANXP SemiconductorsIC MPU I.MX8MN 1.5GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
157
MIMX8MN3CVPIZAAMIMX8MN3CVPIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 306TFBGAMicroprocessors306-TFBGA (11x11)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
306-TFBGA
Supplier Device Package:
306-TFBGA (11×11)
1,189
MIMX8MN3CVTIZAAMIMX8MN3CVTIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
920
MIMX8MN3DVPIZAAMIMX8MN3DVPIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 306TFBGAMicroprocessors306-TFBGA (11x11)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
306-TFBGA
Supplier Device Package:
306-TFBGA (11×11)
191
MIMX8MN3DVTJZAAMIMX8MN3DVTJZAANXP SemiconductorsIC MPU I.MX8MN 1.5GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
305
MIMX8MN4CVTIZAAMIMX8MN4CVTIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
1,901
MIMX8MN4DVTJZAAMIMX8MN4DVTJZAANXP SemiconductorsIC MPU I.MX8MN 1.5GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
1,131
MIMX8MN5CVPIZAAMIMX8MN5CVPIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 306TFBGAMicroprocessors306-TFBGA (11x11)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
306-TFBGA
Supplier Device Package:
306-TFBGA (11×11)
628
MIMX8MN5CVTIZAAMIMX8MN5CVTIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
687
MIMX8MN5DVPIZAAMIMX8MN5DVPIZAANXP SemiconductorsIC MPU I.MX8MN 1.4GHZ 306TFBGAMicroprocessors306-TFBGA (11x11)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 OTG + PHY (1)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
306-TFBGA
Supplier Device Package:
306-TFBGA (11×11)
894
MIMX8MN5DVTJZAAMIMX8MN5DVTJZAANXP SemiconductorsIC MPU I.MX8MN 1.5GHZ 486LFBGAMicroprocessors486-LFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M7
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
486-LFBGA, FCBGA
Supplier Device Package:
486-LFBGA (14×14)
604

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