 | | MIMX8MM6CVTKZAA | NXP Semiconductors | IC MPU I.MX8MM 1.6GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 1,866 | |
| N/A | | MIMX8MM6CVTKZAAR | NXP Semiconductors | I.MX 8M MINI QUAD | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 486-LFBGA (14×14) | 574 | |
 | | MIMX8MM6DVTLZAA | NXP Semiconductors | IC MPU I.MX8MM 1.8GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 556 | |
 | | MIMX8MM6DVTLZAAR | NXP Semiconductors | IC MPU I.MX8MM 1.8GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Mounting Type: Surface Mount Supplier Device Package: 486-LFBGA (14×14) | 1,097 | |
 | | MIMX8MN1CVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI USB: USB 2.0 OTG + PHY (1) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 306-TFBGA (11×11) | 21 | |
 | | MIMX8MN1CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 320 | |
 | | MIMX8MN1DVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI USB: USB 2.0 OTG + PHY (1) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 306-TFBGA (11×11) | 457 | |
 | | MIMX8MN1DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 874 | |
| N/A | | MIMX8MN2CVTIZAA | NXP Semiconductors | IC MPU 1.4GHZ/750MHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 486-LFBGA (14×14) | 946 | |
 | | MIMX8MN2DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 157 | |
 | | MIMX8MN3CVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 306-TFBGA (11×11) | 1,189 | |
 | | MIMX8MN3CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 920 | |
 | | MIMX8MN3DVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI USB: USB 2.0 OTG + PHY (1) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 306-TFBGA (11×11) | 191 | |
 | | MIMX8MN3DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 305 | |
 | | MIMX8MN4CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 1,901 | |
 | | MIMX8MN4DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 1,131 | |
 | | MIMX8MN5CVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI USB: USB 2.0 OTG + PHY (1) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 306-TFBGA (11×11) | 628 | |
 | | MIMX8MN5CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 687 | |
 | | MIMX8MN5DVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI USB: USB 2.0 OTG + PHY (1) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 306-TFBGA (11×11) | 894 | |
 | | MIMX8MN5DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 604 | |