Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AMIMX8QP6AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 125 °C
Speed:
1.3 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Ethernet:
1G, AVB
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Qualification:
Automotive
111
N/AMIMX8QP6AVUFFABNXP SemiconductorsIC MPU I.MX8Q 266MHZ 1313FCPBGAMicroprocessors1313-FCPBGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F
Number of Cores/Bus Width:
7 Core, 64-Bit
Speed:
1.6GHz, 1.26GHz, 266MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
1Gbps (2)
USB:
USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Mounting Type:
Surface Mount
Package / Case:
1313-BBGA, FCBGA
Supplier Device Package:
1313-FCPBGA (29×29)
521
N/AN/AMIMX8QP6CVUFFABNXP SemiconductorsMPU I.MX8 QUAD PLUSMicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
1.3 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Ethernet:
1G, AVB
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
Qualification:
Industrial
80
N/AN/AMIMX8QX1AVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors-N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
675
N/AN/AMIMX8QX1FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
803
N/AN/AMIMX8QX1FVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
1,085
N/AN/AMIMX8QX2AVOFZACNXP SemiconductorsI.MX8 QXP 17X17Microprocessors-N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
580
N/AN/AMIMX8QX2FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
827
N/AN/AMIMX8QX2FVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
333
MIMX8QX5CVLFZACN/AMIMX8QX5CVLFZACNXP SemiconductorsMIMX8QX5CVLFZACMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
411
N/AN/AMIMX8QX5FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
977
N/AN/AMIMX8QX5GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
1,114
MIMX8QX6AVLFZACMIMX8QX6AVLFZACNXP SemiconductorsIC MPU 609FBGAMicroprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
55
MIMX8QX6CVLFZACN/AMIMX8QX6CVLFZACNXP SemiconductorsMIMX8QX6CVLFZACMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
478
N/AN/AMIMX8QX6FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
975
N/AN/AMIMX8QX6GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
1,041
N/AN/AMIMX8SL1AVNFZABNXP SemiconductorsI.MX8 DXL 15SQMicroprocessors388-LBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
1Gbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
388-LFBGA
Supplier Device Package:
388-LBGA (15×15)
365
N/AN/AMIMX8SL1CVNFZABNXP SemiconductorsI.MX 8DUALXLITE 15SQMicroprocessors388-LBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
1Gbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
388-LFBGA
Supplier Device Package:
388-LBGA (15×15)
1,846
N/AN/AMIMX8SL1CVNFZBANXP SemiconductorsI.MX8SOLOLXLITE 15SQMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
1 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
1Gbps (2)
USB:
USB 2.0 + PHY (2)
Graphics Acceleration:
No
Co-Processors/DSP:
ARM® Cortex®-M4F
Display & Interface Controllers:
LCD
1,491
N/AMIMX8UD3CVP08SCNXP Semiconductors8ULP DUAL CORTEX A35MicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
800 MHz
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR3, LPDDR4
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Graphics Acceleration:
Yes
Co-Processors/DSP:
3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Qualification:
Industrial
1,637

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up