| N/A | N/A | MIMX8QP6AVUFEAB | NXP Semiconductors | IC | Microprocessors | N/A | N/A | -40 °C – 125 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI | 111 | |
| N/A | | MIMX8QP6AVUFFAB | NXP Semiconductors | IC MPU I.MX8Q 266MHZ 1313FCPBGA | Microprocessors | 1313-FCPBGA (29x29) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F Number of Cores/Bus Width: 7 Core, 64-Bit Speed: 1.6GHz, 1.26GHz, 266MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: Yes Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Mounting Type: Surface Mount Package / Case: 1313-BBGA, FCBGA Supplier Device Package: 1313-FCPBGA (29×29) | 521 | |
| N/A | N/A | MIMX8QP6CVUFFAB | NXP Semiconductors | MPU I.MX8 QUAD PLUS | Microprocessors | N/A | N/A | -40 °C – 105 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI | 80 | |
| N/A | N/A | MIMX8QX1AVOFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 17X17 | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 675 | |
| N/A | N/A | MIMX8QX1FVLFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 803 | |
| N/A | N/A | MIMX8QX1FVOFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 17X17 | Microprocessors | 417-FBGA (17x17) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Supplier Device Package: 417-FBGA (17×17) | 1,085 | |
| N/A | N/A | MIMX8QX2AVOFZAC | NXP Semiconductors | I.MX8 QXP 17X17 | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 580 | |
| N/A | N/A | MIMX8QX2FVLFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 827 | |
| N/A | N/A | MIMX8QX2FVOFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 17X17 | Microprocessors | 417-FBGA (17x17) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Supplier Device Package: 417-FBGA (17×17) | 333 | |
 | N/A | MIMX8QX5CVLFZAC | NXP Semiconductors | MIMX8QX5CVLFZAC | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 411 | |
| N/A | N/A | MIMX8QX5FVLFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 977 | |
| N/A | N/A | MIMX8QX5GVLFZAC | NXP Semiconductors | I.MX 8X FIPS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 1,114 | |
 | | MIMX8QX6AVLFZAC | NXP Semiconductors | IC MPU 609FBGA | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 55 | |
 | N/A | MIMX8QX6CVLFZAC | NXP Semiconductors | MIMX8QX6CVLFZAC | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 478 | |
| N/A | N/A | MIMX8QX6FVLFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 975 | |
| N/A | N/A | MIMX8QX6GVLFZAC | NXP Semiconductors | I.MX 8X FIPS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 1,041 | |
| N/A | N/A | MIMX8SL1AVNFZAB | NXP Semiconductors | I.MX8 DXL 15SQ | Microprocessors | 388-LBGA (15x15) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Display & Interface Controllers: LCD Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 388-LBGA (15×15) | 365 | |
| N/A | N/A | MIMX8SL1CVNFZAB | NXP Semiconductors | I.MX 8DUALXLITE 15SQ | Microprocessors | 388-LBGA (15x15) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Display & Interface Controllers: LCD Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 388-LBGA (15×15) | 1,846 | |
| N/A | N/A | MIMX8SL1CVNFZBA | NXP Semiconductors | I.MX8SOLOLXLITE 15SQ | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Co-Processors/DSP: ARM® Cortex®-M4F Display & Interface Controllers: LCD | 1,491 | |
| N/A | | MIMX8UD3CVP08SC | NXP Semiconductors | 8ULP DUAL CORTEX A35 | Microprocessors | N/A | N/A | -40 °C – 105 °C | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: LPDDR3, LPDDR4 Graphics Acceleration: Yes Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP Display & Interface Controllers: MIPI-CSI, MIPI-DSI | 1,637 | |