| N/A | N/A | MIMX8DL1AVNFZABR | NXP Semiconductors | I.MX8 DXL 15SQ | Microprocessors | 388-LBGA (15x15) | N/A | N/A | Core Processor: ARM® Cortex®-M4, ARM® Cortex®-A35 Ethernet: AVB, Gb Ethernet with TSN Display & Interface Controllers: 18-bit LCDIF | 1,356 | |
| N/A | N/A | MIMX8DL1AVNFZBA | NXP Semiconductors | I.MX 8DUALXLITE A1 PRODUCTION PN | Microprocessors | 388-LBGA (15x15) | N/A | N/A | Voltage – I/O: 1.8 V – 3.3 V Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4F | 1,861 | |
| N/A | N/A | MIMX8DL1AVNFZBAR | NXP Semiconductors | I.MX 8DUALXLITE A1 PRODUCTION PN | Microprocessors | 388-LBGA (15x15) | N/A | N/A | Voltage – I/O: 1.8 V – 3.3 V Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4F | 248 | |
| N/A | | MIMX8DL1CVNFZAB | NXP Semiconductors | I.MX 8DUALXLITE 15SQ | Microprocessors | 388-LBGA (15x15) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Display & Interface Controllers: LCD Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 388-LBGA (15×15) | 1,021 | |
| N/A | N/A | MIMX8DX1AVOFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 17X17 | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 748 | |
| N/A | N/A | MIMX8DX1FVLFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 551 | |
| N/A | N/A | MIMX8DX1FVOFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 17X17 | Microprocessors | 417-FBGA (17x17) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Supplier Device Package: 417-FBGA (17×17) | 233 | |
| N/A | N/A | MIMX8DX2AVOFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 17X17 | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 1,019 | |
| N/A | N/A | MIMX8DX2FVLFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 326 | |
| N/A | N/A | MIMX8DX2FVOFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 17X17 | Microprocessors | 417-FBGA (17x17) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Supplier Device Package: 417-FBGA (17×17) | 37 | |
| N/A | N/A | MIMX8DX5AVLFZACR | NXP Semiconductors | I.MX 8DUALXPLUS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 194 | |
 | N/A | MIMX8DX5CVLFZAC | NXP Semiconductors | MIMX8DX5CVLFZAC | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 3 | |
| N/A | N/A | MIMX8DX5FVLFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 1,060 | |
| N/A | N/A | MIMX8DX5GVLFZAC | NXP Semiconductors | I.MX 8X FIPS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 172 | |
 | N/A | MIMX8DX6CVLFZAC | NXP Semiconductors | MIMX8DX6CVLFZAC | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 1,696 | |
| N/A | N/A | MIMX8DX6FVLFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 1,509 | |
| N/A | N/A | MIMX8DX6GVLFZAC | NXP Semiconductors | I.MX 8X FIPS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21×21) | 220 | |
 | | MIMX8MD6CVAHZAA | NXP Semiconductors | IC MPU I.MX8MD 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,805 | |
 | | MIMX8MD6CVAHZAB | NXP Semiconductors | IC MPU I.MX8MD 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 302 | |
 | | MIMX8MD6DVAJZAA | NXP Semiconductors | IC MPU I.MX8MD 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 583 | |