Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AMIMX8DL1AVNFZABRNXP SemiconductorsI.MX8 DXL 15SQMicroprocessors388-LBGA (15x15)N/AN/A
Speed:
1.2 GHz
Core Processor:
ARM® Cortex®-M4, ARM® Cortex®-A35
RAM Controllers:
LPDDR4
Ethernet:
AVB, Gb Ethernet with TSN
Display & Interface Controllers:
18-bit LCDIF
Qualification:
Automotive
1,356
N/AN/AMIMX8DL1AVNFZBANXP SemiconductorsI.MX 8DUALXLITE A1 PRODUCTION PNMicroprocessors388-LBGA (15x15)N/AN/A
Voltage – I/O:
1.8 V – 3.3 V
Number of Cores/Bus Width:
2 Core, 64-Bit
USB:
USB 2.0 + PHY (2)
Graphics Acceleration:
No
Co-Processors/DSP:
ARM® Cortex®-M4F
1,861
N/AN/AMIMX8DL1AVNFZBARNXP SemiconductorsI.MX 8DUALXLITE A1 PRODUCTION PNMicroprocessors388-LBGA (15x15)N/AN/A
Voltage – I/O:
1.8 V – 3.3 V
Number of Cores/Bus Width:
2 Core, 64-Bit
USB:
USB 2.0 + PHY (2)
Graphics Acceleration:
No
Co-Processors/DSP:
ARM® Cortex®-M4F
248
N/AMIMX8DL1CVNFZABNXP SemiconductorsI.MX 8DUALXLITE 15SQMicroprocessors388-LBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
1Gbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
388-LFBGA
Supplier Device Package:
388-LBGA (15×15)
1,021
N/AN/AMIMX8DX1AVOFZACNXP SemiconductorsI.MX 8DUALXPLUS 17X17Microprocessors-N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
748
N/AN/AMIMX8DX1FVLFZACNXP SemiconductorsI.MX 8DUALXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
551
N/AN/AMIMX8DX1FVOFZACNXP SemiconductorsI.MX 8DUALXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
233
N/AN/AMIMX8DX2AVOFZACNXP SemiconductorsI.MX 8DUALXPLUS 17X17Microprocessors-N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
1,019
N/AN/AMIMX8DX2FVLFZACNXP SemiconductorsI.MX 8DUALXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
326
N/AN/AMIMX8DX2FVOFZACNXP SemiconductorsI.MX 8DUALXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
37
N/AN/AMIMX8DX5AVLFZACRNXP SemiconductorsI.MX 8DUALXPLUSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
194
MIMX8DX5CVLFZACN/AMIMX8DX5CVLFZACNXP SemiconductorsMIMX8DX5CVLFZACMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
3
N/AN/AMIMX8DX5FVLFZACNXP SemiconductorsI.MX 8DUALXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
1,060
N/AN/AMIMX8DX5GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
172
MIMX8DX6CVLFZACN/AMIMX8DX6CVLFZACNXP SemiconductorsMIMX8DX6CVLFZACMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
1,696
N/AN/AMIMX8DX6FVLFZACNXP SemiconductorsI.MX 8DUALXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
1,509
N/AN/AMIMX8DX6GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
220
MIMX8MD6CVAHZAAMIMX8MD6CVAHZAANXP SemiconductorsIC MPU I.MX8MD 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
1,805
MIMX8MD6CVAHZABMIMX8MD6CVAHZABNXP SemiconductorsIC MPU I.MX8MD 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
302
MIMX8MD6DVAJZAAMIMX8MD6DVAJZAANXP SemiconductorsIC MPU I.MX8MD 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
583

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