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Total Products: 3,239
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AS32G379ASCK1VUCRNXP Semiconductors4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
1,351
N/AS32G379ASCK1VUCTNXP Semiconductors4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
988
N/AS32G398AAAK1VUCTNXP Semiconductors3XM7 400MHZ, 8XA53 1GHZ, 525BGMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
384
N/AS32G398AABK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
1,165
N/AS32G398AACK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
283
S32G398AACK1VUCTS32G398AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
153
N/AS32G398ASAK1VUCTNXP Semiconductors8XA53 - 1.0GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
683
N/AS32G398ASCK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
235
N/AS32G398ASCK1VUCTNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
1,556
N/AS32G399AAAK1VUCTNXP Semiconductors8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
964
N/AS32G399AABK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
226
N/AS32G399AACK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
78
S32G399AACK1VUCTS32G399AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
19
N/AS32G399ASAK1VUCTNXP Semiconductors8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
1,290
N/AS32G399ASBK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
1,275
N/AS32G399ASCK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
19
N/AS32G399ASCK1VUCTNXP Semiconductors8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
193
SCIMX6G3CVML5AASCIMX6G3CVML5AANXP SemiconductorsCORTEX A7 RISC MICROPROCESSOR 32MicroprocessorsN/AN/AN/A
Voltage – I/O:
1.8 V – 3.15 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Qualification:
Industrial
704
N/ASCIMX6S6AVM083CNXP SemiconductorsI.MX 6 SERIES 32-BIT MPU ARM CORMicroprocessors-N/A–
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Display & Interface Controllers:
Keypad, LCD
257
N/ASCIMX6S6AVM083CRNXP SemiconductorsI.MX 6 SERIES 32-BIT MPU ARM CORMicroprocessors-N/A–
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Display & Interface Controllers:
Keypad, LCD
1,744

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