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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MCIMX6Y2DVM05AAR
MCIMX6Y2DVM05AARNXP SemiconductorsIC MPU I.MX6 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CANbus, I2C, SPI, UART
992
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MCIMX6Y2DVM05AB
MCIMX6Y2DVM05ABNXP SemiconductorsIC MPU I.MX6 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CANbus, I2C, SPI, UART
1,020
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N/AN/AMCIMX6Y2DVM05ABRNXP SemiconductorsI.MX 32-BIT MPU, ARM CORTEX-A7 CMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CANbus, I2C, SPI, UART
736
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MCIMX6Y2DVM09AA
MCIMX6Y2DVM09AANXP SemiconductorsIC MPU I.MX6 900MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
900MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CANbus, I2C, SPI, UART
220
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QUOTE
MCIMX6Y2DVM09AB
MCIMX6Y2DVM09ABNXP SemiconductorsIC MPU I.MX6 900MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
900MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CANbus, I2C, SPI, UART
718
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MCIMX6Y7DVK05AA
MCIMX6Y7DVK05AANXP SemiconductorsIC MPU I.MX6 528MHZ 272MAPBGAMicroprocessors272-MAPBGA (9x9)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
272-LFBGA
Supplier Device Package:
272-MAPBGA (9×9)
Additional Interfaces:
CAN, I2C, SPI, UART
914
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QUOTE
MCIMX6Y7DVK05AB
MCIMX6Y7DVK05ABNXP SemiconductorsIC MPU I.MX6 528MHZ 272MAPBGAMicroprocessors272-MAPBGA (9x9)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
272-LFBGA
Supplier Device Package:
272-MAPBGA (9×9)
Additional Interfaces:
CAN, I2C, SPI, UART
725
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MCIMX6Y7DVM09AA
MCIMX6Y7DVM09AANXP SemiconductorsIC MPU I.MX6 900MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
900MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CAN, I2C, SPI, UART
441
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QUOTE
MCIMX6Y7DVM09AB
MCIMX6Y7DVM09ABNXP SemiconductorsIC MPU I.MX6 900MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
900MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CAN, I2C, SPI, UART
901
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MCIMX6Z0DVM09AB
MCIMX6Z0DVM09ABNXP SemiconductorsIC MPU I.MX6 900MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
900MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad
USB:
USB 2.0 OTG + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
1,441
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QUOTE
N/AN/AMCIMX6Z0DVM09ABRNXP SemiconductorsI.MX6ULZ, 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
900MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad
USB:
USB 2.0 OTG + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
1,022
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QUOTE
MCIMX7D2DVK12SC
MCIMX7D2DVK12SCNXP SemiconductorsIC MPU I.MX7D 1.2GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 85°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 85°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
896
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QUOTE
MCIMX7D2DVK12SDN/AMCIMX7D2DVK12SDNXP SemiconductorsIC MPU I.MX7D 1.2GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 85°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 85°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
1,178
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QUOTE
MCIMX7D2DVM12SC
MCIMX7D2DVM12SCNXP SemiconductorsIC MPU I.MX7D 1.2GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A0°C ~ 85°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 85°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
593
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QUOTE
MCIMX7D2DVM12SD
MCIMX7D2DVM12SDNXP SemiconductorsIC MPU I.MX7D 1.2GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A0°C ~ 85°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 85°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
129
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QUOTE
MCIMX7D3DVK10SCN/AMCIMX7D3DVK10SCNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
670
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QUOTE
MCIMX7D3DVK10SDN/AMCIMX7D3DVK10SDNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
971
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QUOTE
MCIMX7D3EVK10SC
MCIMX7D3EVK10SCNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
617
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QUOTE
MCIMX7D3EVK10SD
MCIMX7D3EVK10SDNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
107
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QUOTE
MCIMX7D5EVK10SD
MCIMX7D5EVK10SDNXP SemiconductorsIC MPU I.MX7D 1GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
612
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QUOTE

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