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Electronic Parts Search

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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MC68EN302AG25BT
MC68EN302AG25BTNXP SemiconductorsIC MPU M683XX 25MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
78
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MC68EN302PV20BT
MC68EN302PV20BTNXP SemiconductorsIC MPU M683XX 20MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
169
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MC68EN302PV25BT
MC68EN302PV25BTNXP SemiconductorsIC MPU M683XX 25MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
1,262
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MC68EN360AI25L
MC68EN360AI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
740
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MC68EN360AI25VL
MC68EN360AI25VLNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
116
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MC68EN360AI33L
MC68EN360AI33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,131
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MC68EN360CAI25L
MC68EN360CAI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,047
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MC68EN360CEM25L
MC68EN360CEM25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
698
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N/A
MC68EN360CRC25LNXP SemiconductorsIC MPU M683XX 25MHZ 241PGAMicroprocessors241-PGA (47.24x47.24)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
241-BEPGA
Supplier Device Package:
241-PGA (47.24×47.24)
Additional Interfaces:
SCC, SMC, SPI
651
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MC68EN360CVR25L
MC68EN360CVR25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
97
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MC68EN360CZQ25L
MC68EN360CZQ25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)5.0V-40°C – 85°C
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Mounting Type:
Surface Mount
561
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MC68EN360EM25L
MC68EN360EM25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
784
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MC68EN360EM25VL
MC68EN360EM25VLNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,551
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MC68EN360EM33L
MC68EN360EM33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,178
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N/A
MC68EN360RC25LNXP SemiconductorsIC MPU M683XX 25MHZ 241PGAMicroprocessors241-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
241-BEPGA
Supplier Device Package:
241-PGA (47.24×47.24)
Additional Interfaces:
SCC, SMC, SPI
1,341
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QUOTE
MC68EN360VR25L
MC68EN360VR25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
471
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MC68EN360VR25LR2
MC68EN360VR25LR2NXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
1,372
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MC68EN360VR25VL
MC68EN360VR25VLNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
882
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MC68EN360VR33L
MC68EN360VR33LNXP SemiconductorsIC MPU M683XX 33MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
298
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MC68EN360ZP25VL
MC68EN360ZP25VLNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
1,370
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