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Total Products: 31,199
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/ART4G150L-LGG1657RMicrochip TechnologyRT4G150L-LGG1657RFPGAs1657-CLGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
265
N/ART4G150L-LGG1657VMicrochip TechnologyRT4G150L-LGG1657VFPGAs1657-CLGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
1,014
SAM9X60-V/DWBSAM9X60-V/DWBMicrochip TechnologyIC MPU SAM9X60 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
Grade:
Industrial
1,291
SAM9X60-V/DWBVAON/ASAM9X60-V/DWBVAOMicrochip TechnologyIC MPU SAM9X 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
Grade:
Industrial
510
SAM9X60D1G-I/4FBSAM9X60D1G-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
Grade:
Industrial
1,716
SAM9X60D1G-I/LZBN/ASAM9X60D1G-I/LZBMicrochip TechnologyIC MPU SAM9X 600MHZMicroprocessors-N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Grade:
Industrial
872
SAM9X60D1GT-I/4FBSAM9X60D1GT-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
Grade:
Industrial
1,602
SAM9X60D5M-I/4FBSAM9X60D5M-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
Grade:
Industrial
1,444
SAM9X60D5MT-I/4FBSAM9X60D5MT-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
Grade:
Industrial
730
SAM9X60D6K-I/4GBSAM9X60D6K-I/4GBMicrochip TechnologyIC MPU SAM9X 600MHZ 196TFBGAMicroprocessors196-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
SDR, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
196-TFBGA
Supplier Device Package:
196-TFBGA (11×11)
Grade:
Industrial
664
SAM9X60D6KT-I/4GBSAM9X60D6KT-I/4GBMicrochip TechnologyIC MPU SAM9X 600MHZ 196TFBGAMicroprocessors196-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
SDR, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
196-TFBGA
Supplier Device Package:
196-TFBGA (11×11)
Grade:
Industrial
1,566
SAM9X60T-V/DWBSAM9X60T-V/DWBMicrochip TechnologyIC MPU SAM9X60 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
Grade:
Industrial
1,257
SAM9X60T-V/DWBVAON/ASAM9X60T-V/DWBVAOMicrochip TechnologyIC MPU SAM9X 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
Grade:
Industrial
590
SAM9X70-I/4PBSAM9X70-I/4PBMicrochip TechnologyARM926 MPU,BGA,I TEMP,TRAYMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
93
N/ASAM9X70-V/4PBMicrochip TechnologyARM926 MPU,BGA,EXT TEMPMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
1,015
SAM9X70T-I/4PBSAM9X70T-I/4PBMicrochip TechnologyARM926 MPU,BGA,I TEMP,T&RMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
148
N/ASAM9X70T-V/4PBMicrochip TechnologyARM926 MPU,BGA,EXT TEMP,T&RMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
371
SAM9X72-I/4PBSAM9X72-I/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,I TEMMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
903
N/ASAM9X72-V/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,EXT TMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
1,088
SAM9X72T-I/4PBSAM9X72T-I/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,I TEMMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
884

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