| N/A | | RT4G150L-LGG1657R | Microchip Technology | RT4G150L-LGG1657R | FPGAs | 1657-CLGA (42.5x42.5) | 1.14 V - 1.26 V | -55°C – 125°C | Number of LABs/CLBs: 151824 Number of Logic Elements/Cells: 151824 | 1,063 | |
| N/A | N/A | RT4G150L-LGG1657V | Microchip Technology | RT4G150L-LGG1657V | FPGAs | 1657-CLGA (42.5x42.5) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 1657-BCLGA Supplier Device Package: 1657-CLGA (42.5×42.5) | 90 | |
 | | SAM9X60-V/DWB | Microchip Technology | IC MPU SAM9X60 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 228-TFBGA (11×11) | 135 | |
 | | SAM9X60-V/DWBVAO | Microchip Technology | IC MPU SAM9X 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Supplier Device Package: 228-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1,187 | |
 | | SAM9X60D1G-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 233-TFBGA (14×14) | 1,766 | |
 | | SAM9X60D1G-I/LZB | Microchip Technology | IC MPU SAM9X 600MHZ | Microprocessors | - | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1,078 | |
 | | SAM9X60D1GT-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 233-TFBGA (14×14) | 1,359 | |
 | | SAM9X60D5M-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 233-TFBGA (14×14) | 330 | |
 | | SAM9X60D5MT-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 233-TFBGA (14×14) | 1,013 | |
 | | SAM9X60D6K-I/4GB | Microchip Technology | IC MPU SAM9X 600MHZ 196TFBGA | Microprocessors | 196-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 196-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1,090 | |
 | | SAM9X60D6KT-I/4GB | Microchip Technology | IC MPU SAM9X 600MHZ 196TFBGA | Microprocessors | 196-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 196-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 100 | |
 | | SAM9X60T-V/DWB | Microchip Technology | IC MPU SAM9X60 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 228-TFBGA (11×11) | 1,032 | |
 | | SAM9X60T-V/DWBVAO | Microchip Technology | IC MPU SAM9X 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Supplier Device Package: 228-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1,400 | |
 | | SAM9X70-I/4PB | Microchip Technology | ARM926 MPU,BGA,I TEMP,TRAY | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 807 | |
| N/A | | SAM9X70-V/4PB | Microchip Technology | ARM926 MPU,BGA,EXT TEMP | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,380 | |
 | | SAM9X70T-I/4PB | Microchip Technology | ARM926 MPU,BGA,I TEMP,T&R | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,140 | |
| N/A | | SAM9X70T-V/4PB | Microchip Technology | ARM926 MPU,BGA,EXT TEMP,T&R | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 891 | |
 | | SAM9X72-I/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,I TEM | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LVDS Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 303 | |
| N/A | | SAM9X72-V/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,EXT T | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 438 | |
 | | SAM9X72T-I/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,I TEM | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LVDS Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 812 | |