 | | AVR64EA48T-I/PT | Microchip Technology | IC MCU 8BIT 64KB FLASH 48TQFP | Microcontrollers | 48-TQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, IrDA, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 32x12b; D/A 1x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-TQFP (7×7) | 1,511 | |
| N/A | | AX1000-1BG729 | Microchip Technology | IC FPGA 516 I/O 729BGA | FPGAs | 729-PBGA (35x35) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 1,862 | |
| N/A | | AX1000-1BG729I | Microchip Technology | IC FPGA 516 I/O 729BGA | FPGAs | 729-PBGA (35x35) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 1,546 | |
| N/A | | AX1000-1BG729M | Microchip Technology | IC FPGA 516 I/O 729BGA | FPGAs | 729-PBGA (35x35) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 729-PBGA (35×35) | 649 | |
| N/A | | AX1000-1BGG729 | Microchip Technology | IC FPGA 516 I/O 729BGA | FPGAs | 729-PBGA (35x35) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 430 | |
| N/A | | AX1000-1BGG729I | Microchip Technology | IC FPGA 516 I/O 729BGA | FPGAs | 729-PBGA (35x35) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 1,506 | |
| N/A | | AX1000-1BGG729M | Microchip Technology | IC FPGA 516 I/O 729BGA | FPGAs | 729-PBGA (35x35) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 587 | |
| N/A | | AX1000-1CQ352M | Microchip Technology | IC FPGA 198 I/O 352CQFP | FPGAs | 352-CQFP (75x75) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Package / Case: 352-BFCQFP with Tie Bar Supplier Device Package: 352-CQFP (75×75) | 705 | |
 | | AX1000-1FG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 457 | |
 | | AX1000-1FG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 330 | |
 | | AX1000-1FG484M | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 335 | |
 | | AX1000-1FG676 | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 676-FBGA (27×27) | 497 | |
 | | AX1000-1FG676I | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 676-FBGA (27×27) | 240 | |
| N/A | | AX1000-1FG676M | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 676-FBGA (27×27) | 360 | |
| N/A | | AX1000-1FG896M | Microchip Technology | IC FPGA 516 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 745 | |
 | | AX1000-1FGG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 169 | |
 | | AX1000-1FGG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 617 | |
 | | AX1000-1FGG484M | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 1,587 | |
 | | AX1000-1FGG676 | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 676-FBGA (27×27) | 1,324 | |
 | | AX1000-1FGG676I | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 319 | |